System for dissipating heat energy
View Patent ↗A sustainable system for cooling at least one electronic device, for example a Light Emitting Diode (LED), and preferably a plurality of electronic devices, using at least one heat absorbing material contained within a housing that it is in thermal communication with the electronic devices. The heat absorbing materials may be present individually or in combinations thereof in order to achieve the desired heat absorption effect; the housing may include multiple chambers containing heat absorbing materials or combinations thereof.
1. A system for dissipating heat energy comprising:
at least one electronic device;
at least one housing, wherein said at least one housing is in thermal communication with said at least one electronic device; and
at least one first heat absorbing material and at least one second heat absorbing material contained within said at least one housing;
wherein said at least one housing comprises a first chamber and a second chamber, said first chamber containing said at least one first heat absorbing material and said second chamber containing said at least one second heat absorbing material.
2. The system of claim 1 , wherein said at least one first heat absorbing material and said at least one second heat absorbing material are independently selected from the group consisting of an organic paraffin compound, n-octadecane, low-temperature solder alloy, low-temperature metal, neicosane, muriatic acid, stearic acid, acetamide, wax, a eutectic alloy of bismuth, a eutectic alloy of lead, an eutectic alloy of tin, eutectic salt, an alkali metal, a hydrate of the inorganic salts of alkali, a hydrated salt, a eutectic of the chlorides, a nitrate, an acetate, and an ammoniate of the light metals.
3. The system of claim 1 , wherein said at least one electronic device comprises an LED.
4. The system of claim 1 , wherein at least one of said at least one first heat absorbing material and said at least one second heat absorbing material comprises a phase change material.
5. The system of claim 1 , wherein at least one of said at least one first heat absorbing material and said at least one second heat absorbing material comprises an ion crystal forming material.
6. The system of claim 1 , wherein at least one of said at least one first heat absorbing material and said at least one second heat absorbing material comprises a material selected from the group consisting of an organic paraffin compound, n-octadecane, low-temperature solder alloy, low-temperature metal, neicosane, muriatic acid, stearic acid, acetamide, wax, a eutectic alloy of bismuth, a eutectic alloy of lead, an eutectic alloy of tin, eutectic salt, an alkali metal, a hydrate of the inorganic salts of alkali, a hydrated salt, a eutectic of the chlorides, a nitrate, an acetate, and an ammoniate of the light metals.
7. The system of claim 6 , wherein said at least one first heat absorbing material and said at least one second heat absorbing material comprises two or more heat absorbing materials.
8. The system of claim 1 , wherein at least one of said at least one first heat absorbing material and said at least one second heat absorbing material comprises a microencapsulated material.