IP Library Granted Patent US 7,744,252
Granted Patent B2
US 7,744,252 · App. 12/192,506 · Granted Jun 29, 2010

Sustainably constructed heat dissipating integrated lighting surface

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Quick Facts
Patent No.
US 7,744,252
App. No.
12/192,506
Granted
Jun 29, 2010
Kind
B2
Abstract

A lighted heat dissipating panel made of sustainable renewable materials such as recycled aluminum and soy-based urethane, for use in architectural or shelving applications. The panel may be flat, rectangular, curvilinear, or of varying cross section so as to include any three-dimensional shape as desired. Lightweight materials such as carbon fiber, fiberglass, resin, soy-based urethane, and similar materials are used in combination with thermally conductive structural materials, such as expanded aluminum honeycomb, preferably fabricated from recycled aluminum, to provide a stiff, lightweight, machinable, moldable, and thermally conductive panel for use with lighting elements. Lighting elements are housed within the panel, providing illumination as desired. Heat is transferred from the lighting elements through the panel to the supporting structure and radiated from the panel itself, providing cooling effect for the lighting elements, reducing the temperature in the immediate vicinity of the lighting elements and providing for longer lighting element life.

Claims (10)

1. A lighted heat dissipating panel, comprising

a heat dissipating panel comprising an expanded aluminum honeycomb structure substantially filled with glass-carbon material, said heat dissipating panel having a top surface and a bottom surface, and further having at least one groove for accepting a lighting element assembly, said groove having a bottom surface and an opening, and said heat dissipating panel further having a first mounting edge and a second mounting edge;

at least one lighting element assembly comprising a printed circuit board substrate having a first surface and a second surface, said printed circuit board first surface comprising conductive traces in electrical communication with at least one lighting emitting diode, and wherein said printed circuit board second surface is attached to said groove bottom surface; and

a plurality of ball detent assemblies retainingly engaged in said first mounting edge, and a plurality of ball detent assemblies retainingly engaged in said second mounting edge, said ball detent assemblies in electrical communication with said light emitting diodes.

2. The lighted heat dissipating panel of claim 1 , wherein said aluminum is recycled aluminum.

3. The lighted heat dissipating panel of claim 2 , wherein said top surface further comprises at least one layer of structural cloth selected from the group consisting of fiberglass and carbon fiber, wherein said structural cloth is bonded to said top surface by a bonding agent selected from the group consisting of epoxy resin, ester resin, urethane, and soy-based urethane, and wherein said bottom surface further comprises at least one layer of structural cloth selected from the group consisting of fiberglass and carbon fiber, wherein said structural cloth is bonded to said bottom surface by a bonding agent selected from the group consisting of epoxy resin, ester resin, urethane, and soy-based urethane.

4. The lighted heat dissipating panel of claim 3 , wherein said light emitting diode is an organic light emitting diode.

5. The lighted heat dissipating panel of claim 1 , further comprising a transparent window enclosing said groove opening.

6. The lighted heat dissipating panel of claim 1 , wherein said top surface further comprises at least one layer of structural cloth selected from the group consisting of fiberglass and carbon fiber, wherein said structural cloth selected from the group consisting of fiberglass and carbon fiber, wherein said structural cloth is bonded to said top surface by a bonding agent selected from the group consisting of fiberglass and carbon fiber, wherein said structural cloth is bonded to said bottom surface by a bonding agent selected from the group consisting of epoxy resin, ester resin, urethane, and soy-based urethane.

7. The lighted heat dissipating panel of claim 6 , wherein said light emitting diode is further comprised of surface mount packaging.

Assignments (10)
RELEASE OF SECURITY INTEREST Recorded Aug 14, 2018
From: MEDLEY CAPITAL CORPORATION
To: LIGHTING SCIENCE GROUP CORPORATION, A DELAWARE CORPORATION; BIOLOGICAL ILLUMINATION, LLC, A DELAWARE LIMITED LIABILITY COMPANY
Reel/Frame 048018/0515 →
RELEASE OF SECURITY INTEREST Recorded Apr 26, 2017
From: ACF FINCO I LP, A DELAWARE LIMITED PARTNERSHIP
To: LIGHTING SCIENCE GROUP CORPORATION, A DELAWARE CORPORATION; BIOLOGICAL ILLUMINATION, LLC, A DELAWARE LIMITED LIABILITY COMPANY
Reel/Frame 042340/0471 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTERESTS IN PATENTS Recorded May 26, 2015
From: FCC, LLC D/B/A FIRST CAPITAL
To: ACF FINCO I LP
Reel/Frame 035774/0632 →
SECURITY INTEREST Recorded Jun 2, 2014
From: LIGHTING SCIENCE GROUP CORPORATION; BIOLOGICAL ILLUMINATION, LLC
To: MEDLEY CAPTIAL CORPORATION, AS AGENT
Reel/Frame 033072/0395 →
SECURITY INTEREST Recorded Apr 28, 2014
From: LIGHTING SCIENCE GROUP CORPORATION; BIOLOGICAL ILLUMINATION, LLC
To: FCC, LLC D/B/A FIRST CAPITAL, AS AGENT
Reel/Frame 032765/0910 →
RELEASE OF SECURITY INTEREST Recorded Mar 26, 2014
From: ARES CAPITAL CORPORATION
To: LIGHTING SCIENCE GROUP CORPORATION
Reel/Frame 032527/0427 →
RELEASE OF SECURITY INTEREST Recorded Mar 25, 2014
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: LIGHTING SCIENCE GROUP CORPORATION
Reel/Frame 032520/0074 →
SECURITY AGREEMENT Recorded Sep 21, 2011
From: LIGHTING SCIENCE GROUP CORPORATION
To: ARES CAPITAL CORPORATION
Reel/Frame 026940/0875 →
SECURITY AGREEMENT Recorded Nov 23, 2010
From: LIGHTING SCIENCE GROUP CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 026109/0019 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2009
From: MAXIK, FREDRIC S.
To: LIGHTING SCIENCE GROUP CORPORATION
Reel/Frame 022680/0473 →