Method for testing integrity of a base for printhead integrated circuitry

1. A method for assembling and testing a base for printhead integrated circuits, said method comprising the steps of:

providing a plurality of molded base components;

assembling the base from the plurality of molded components by bonding the components together, the assembled base having at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths;

engaging the, or each, fluid inlet of the base to a fluid supply in a sealing manner;

charging the base with pressurized fluid until a predetermined pressure is reached;

monitoring the pressure in the base for a predetermined period of time, wherein a rate of pressure decay is indicative of an integrity of the base; and

identifying the base as suitable for subsequent attachment of the printhead integrated circuits if the rate of pressure decay is below a predetermined threshold.

2. The method of claim 1 , in which the fluid inlet is engaged with a pneumatic system so that the base is charged with pressurized air.

3. The method of claim 2 , in which the pressurized air is subjected to primary and secondary regulation substantially to neutralize the effect of supply pressure variations.

4. The method of claim 2 , wherein the step of monitoring includes the step of sensing the pressure in the pneumatic circuit and generating a signal representing a value associated with the pressure.

5. The method of claim 4 , wherein the step of monitoring includes indicating data associated with said value to an operator.

6. The method of claim 1 , wherein the step of sealing includes clamping the fluid inlet to the fluid supply via a clamping arrangement.