IP Library Granted Patent US 8,120,128
Granted Patent B2
US 8,120,128 · App. 12/194,193 · Granted Feb 21, 2012

Optical device

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Quick Facts
Patent No.
US 8,120,128
App. No.
12/194,193
Granted
Feb 21, 2012
Kind
B2
Abstract

An optical device includes a base and an optical element. The base has a through hole in a center and includes leads and a resin. Each lead has an L-shaped cross-section and is formed by an inner lead extending from the center toward a peripheral edge and an outer lead connected to the inner lead and extending downward. The optical element is provided under the base so as to correspond to the through hole. Electrode pads of the optical element are connected to the leads of the base through bumps, respectively. The resin is formed so as to cover respective inner ends of the leads and respective front surfaces of the inner leads and to fill a gap between adjacent leads, and respective outer ends of the leads and respective front surfaces of the outer leads are exposed.

Claims (20)

1. An optical device, comprising:

a base having a main surface and a side surface which surrounds the main surface, having a through hole formed in a center of the main surface and including leads and a resin, the leads having L-shaped cross-sections and being formed by inner leads extending from the center toward a peripheral edge and outer leads connected to the inner leads and extending downward;

and an optical element provided under the base so as to correspond to the through hole, wherein

electrode pads of the optical element are connected to the leads of the base via bumps,

the resin is formed so as to cover inner ends of the inner leads and front surfaces of the inner leads and to fill a gap between the adjacent outer leads to form the side surface of the base,

front surfaces of the outer leads are exposed to the side surface of the base,

outer ends of the outer leads and the front surfaces of the outer leads are exposed from the resin,

a thickness of each the exposed front surfaces of the outer leads is greater than a thickness of the optical element in a vertical direction, and

an outer side surface of the resin and the exposed front surfaces of the outer leads are flush with one another so as to form a plane.

2. The optical device according to claim 1 , further comprising a thin plate body provided under a back surface of the optical element.

3. The optical device according to claim 2 , wherein the thin plate body is made of a material having high thermal conductivity efficiency.

4. The optical device according to claim 2 , wherein a bonding member is provided between the optical element and the thin plate body.

5. The optical device according to claim 2 , further comprising a transparent member provided in the through hole of the base, wherein the optical element provided under the base is hermetically sealed by the transparent member and the thin plate body.

6. The optical device according to claim 5 , wherein an adhesive is provided between the transparent member and the base.

7. The optical device according to claim 2 , further comprising electrodes provided on a back surface of the thin plate body so as to correspond to external terminals located at the outer ends of the outer leads, respectively.

8. The optical device according to claim 2 , wherein a stepped portion having a shape corresponding to a corner shape of the thin plate body is provided in an outer end region of the base, and the thin plate body is mounted in the stepped portion so that the base and the thin plate body fit together.

9. The optical device according to claim 1 , wherein a part of the resin which is formed on the inner ends of the inner leads has a tapered shape so that an inner diameter of the through hole increases from an upper end toward a lower end.

10. The optical device according to claim 1 , wherein the entirety of each of the leads exhibits the L-shaped cross section.

11. The optical device according to claim 1 , wherein the exposed front surface of each of the outer leads extends downwardly from the respective inner lead.

12. The optical device according to claim 1 , wherein an inner most surface of each of the inner leads is covered by the resin.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2015
From: PANASONIC CORPORATION
To: PANNOVA SEMIC, LLC
Reel/Frame 036065/0273 →
CHANGE OF NAME Recorded Mar 6, 2009
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 022363/0306 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2008
From: MATSUMOTO, KATSUYOSHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 021732/0722 →