Granted Patent B2

US 8,081,467 · App. 12/195,079 · Granted Dec 20, 2011

Abstract

Claims (28)

1. An electronics package comprising:

a housing and electronic circuitry carried within said housing;

said housing comprising a first metallic material so that said housing has a first coefficient of thermal expansion (CTE) and has an array of openings therein; and

a thermally conductive body within each of the openings in the array thereof to thereby define a heat sink for said electronic circuitry;

each of said thermally conductive bodies comprising a second metallic material so that each thermally conductive body has a second CTE greater than the first CTE by at least 7.5 in 10 −6 /° K.

2. The electronics package according to claim 1 wherein each opening of the array thereof has a cylindrical shape.

3. The electronics package according to claim 1 wherein each opening of the array thereof extends through said housing.

4. The electronics package according to claim 1 wherein said second material has a higher thermal conductivity than said first material.

5. The electronics package according to claim 1 wherein said first material has a higher melting point than said second material.

6. The electronics package according to claim 1 wherein said first material comprises at least one of titanium, iron-nickel, stainless steel, or kovar.

7. The electronics package according to claim 1 wherein said second material comprises at least one of aluminum, copper, magnesium, or aluminum-berylium.

8. The electronics package according to claim 1 wherein said housing comprises a hermetically sealable housing.

9. An electronics package comprising:

a housing and electronic circuitry carried within said housing;

said housing comprising a first metallic material so that said housing has a first coefficient of thermal expansion (CTE) and has an array of openings therein arranged in a honeycomb pattern; and

a thermally conductive body within each of the openings in the array thereof to thereby define a heat sink for said electronic circuitry;

each of said thermally conductive bodies comprising a second metallic material so that each thermally conductive body has a second CTE greater than the first CTE by at least 7.5 in 10 −6 /° K.

10. The electronics package according to claim 9 wherein each opening of the array thereof has a cylindrical shape.

11. The electronics package according to claim 9 wherein each opening of the array thereof extends through said housing.

12. The electronics package according to claim 9 wherein said second material has a higher thermal conductivity than said first material; and wherein said first material has a higher melting point than said second material.

13. The electronics package according to claim 9 wherein said housing comprises a hermetically sealable housing.

14. A method of making an electronics package comprising:

forming a housing comprising a first metallic material so that the housing has a first coefficient of thermal expansion (CTE) and has an array of openings therein; and

forming a thermally conductive body within each of the openings in the array thereof to thereby define a heat sink for electronic circuitry carried within the housing;

each of the thermally conductive bodies comprising a second metallic material so that each thermally conductive body has a second CTE greater than the first CTE by at least 7.5 in 10 −6 /° K.

15. The method according to claim 14 wherein the array of openings in the housing defines a honeycomb pattern.

16. The method according to claim 14 wherein each opening of the array thereof has a cylindrical shape; and wherein each opening of the array thereof extends through the housing.

17. The method according to claim 14 wherein the second material has a higher thermal conductivity than the first material; and wherein the first material has a higher melting point than the second material.

Assignments (9)