Semiconductor packaging method

1. A semiconductor packaging method, comprising:

(S 1 ) applying a die adhesive to an upper surface of a member through screen-printing;

(S 2 ) B-stage curing the member having the die adhesive;

(S 3 ) attaching a die on the B-stage cured die adhesive;

(S 4 ) wire-bonding the die to the member; and

(S 5 ) encapsulating the outside of the resultant,

wherein after the B-stage curing process of the step S 2 , a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and

wherein the step S 3 is performed such that the die adhesive maintains an adhesive strength of 10 kgf/cm 2 or more at normal temperature after the die attaching.

2. The semiconductor packaging method according to claim 1 ,

wherein in the case that the die adhesive after the step S 2 is left for 1 day or more under conditions of 85° C. temperature and 85% humidity, the die adhesive has a moisture absorption rate of 0.5% or less.

3. The semiconductor packaging method according to claim 1 or 2 ,

wherein the die attaching process of the step S 3 is performed such that an attached area of the die to the die adhesive is 50 to 100% based on the entire area of the applied die adhesive.

4. The semiconductor packaging method according to claim 1 or 2 ,

wherein the die adhesive has a glass transition temperature (Tg) of 50 to 100° C.