LED packaging methods and LED-based lighting products
View Patent ↗A method of packaging a light-emitting diode (LED) chip includes coupling the LED chip to a printed circuit board (PCB) and forming a conductor on a cover plate. Conductive epoxy is applied to at least one of the LED chip and the conductor. The cover plate is coupled to the PCB such that the conductive epoxy forms a circuit connection between the LED chip and the conductor. An LED-based lighting product includes a PCB with one or more LED chips mounted directly thereon. A cover plate has conductors that couple at least to the one or more LED chips and to the PCB, such that the conductors form electrical connections between the one or more LED chips and the PCB.
1. A light emitting diode LED-based lighting product, comprising:
a printed circuit board PCB with one or more LED chips mounted directly thereon; and
a cover plate having conductors that couple to the LED chips and the PCB such that the conductors form electrical connections between the one or more LED chips and the PCB; and a phosphor layer between the one or more LED chips and the cover plate, such that light emitted by the one or more LED chips causes the phosphor layer to fluoresce.
2. The LED-based lighting product of claim 1 , wherein the phosphor layer is removed except where the one or more LED chips face the cover plate.
3. The LED-based lighting product of claim 1 , the cover plate comprising a phosphor.
4. The LED-based lighting product of claim 1 , further comprising a conformal gel between the one or more LED chips and the cover plate.
5. The LED-based lighting product of claim 4 , the conformal gel having a refractive index that is matched to that of the cover plate.
6. The LED-based lighting product of claim 4 , further comprising a phosphor admixed with the conformal gel, such that light emitted by the one or more LED chips causes the phosphor to fluoresce.
7. The LED-based lighting product of claim 1 , further comprising a standoff attached to both the PCB and the cover plate, the standoff defining a distance between the PCB and the cover plate.
8. The LED-based lighting product of claim 7 , the standoff forming an electrical connection between the PCB and one or more of the conductors.
9. The LED-based lighting product of claim 1 , further comprising a reflector attached to at least one of the PCB and the cover plate.
10. The LED-based lighting product of claim 9 , wherein the reflector attaches to both of the PCB and the cover plate, and defines a distance between the PCB and the cover plate.
11. The LED-based lighting product of claim 9 , the reflector forming an electrical connection between the PCB and one or more of the conductors.
12. The LED-based lighting product of claim 1 , further comprising fill material between the PCB and the cover plate.
13. The LED-based lighting product of claim 1 , the cover plate comprising one of glass, quartz, sapphire, plastic, Mylar, polycarbonate, acrylic, polyester and polyethylene.
14. The LED-based lighting product of claim 1 , the cover plate comprising a material having a coefficient of thermal expansion matching that of the PCB.
15. The LED-based lighting product of claim 1 , the cover plate forming optics that modify light passing therethrough.
16. The LED-based lighting product of claim 1 , the one or more LED chips comprising a plurality of LED chips.
17. The LED-based lighting product of claim 16 , the plurality of LED chips arranged as an array on the PCB.
18. The LED-based lighting product of claim 16 , the plurality of LED chips arranged stochastically on the PCB.
19. The LED-based lighting product of claim 1 , the one or more LED chips having a length and width of approximately 250 microns or less.