IP Library Granted Patent US 7,868,258
Granted Patent B2
US 7,868,258 · App. 12/199,682 · Granted Jan 11, 2011

Radio frequency module assembly

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,868,258
App. No.
12/199,682
Granted
Jan 11, 2011
Kind
B2
Abstract

A radio frequency (RF) module assembly includes a substrate on which a predetermined component is mounted, the substrate comprising a connection terminal, and an RF module mounted on the substrate and processing a predetermined RF signal. The RF module includes a housing forming a body, a jack receiving and transmitting a predetermined RF signal, a jack receiving part provided at the housing to allow the jack to be inserted inside the housing and received, and a terminal connected to a connection terminal of the substrate.

Claims (55)

1. A radio frequency (RF) module assembly comprising:

a first substrate on which a predetermined component is mounted, the substrate comprising a connection terminal; and

an RF module mounted on the first substrate and processing a predetermined RF signal, the RF module comprising:

a housing forming a body;

a jack receiving and transmitting a predetermined RF signal;

a jack receiving part provided at the housing to allow the jack to be inserted and received in the housing; and

a terminal connected to the connection terminal of the substrate;

wherein the housing includes a second substrate on which another predetermined component is mounted, the second substrate being electrically connected to the terminal.

2. The RF module of claim 1 , wherein the housing comprises:

an upper cover covering the second substrate,

wherein the jack receiving part is provided at one side of the upper cover.

3. The RF module of claim 2 , wherein the jack receiving part comprises a jack connection hole provided such that the jack passes through the upper cover and is connected to the second substrate and a lower end portion of the jack is placed between the second substrate and the upper cover.

4. The RF module assembly of claim 3 , wherein the jack comprises a connection terminal electrically connected to the second substrate through the jack connection hole.

5. The RF module assembly of claim 4 , wherein a height of the jack protruding from the jack connection hole is controlled through length control of the connection terminal.

6. The RF module assembly of claim 3 , wherein the jack comprises a stopper provided at an outer circumferential surface thereof to prevent separation of the jack from the jack connection hole.

7. The RF module assembly of claim 2 , wherein the jack receiving part comprises a coupling portion recessed in the upper cover to a predetermined depth such that a predetermined portion of the jack is placed therein.

8. The RF module assembly of claim 7 , wherein a length between upper and lower ends of the coupling portion is substantially the same as a height of the jack.

9. The RF module assembly of claim 7 , wherein the coupling portion comprises a coupling hole provided in a lower end of the coupling portion, and a lower end portion of the jack is inserted in and coupled to the coupling hole.

10. The RF module assembly of claim 9 , wherein the jack comprises a connection terminal electrically connected to the second substrate through the coupling hole.

11. The RF module assembly of claim 10 , wherein a height of the jack protruding from the coupling portion is controlled through length control of the connection terminal.

12. The RF module assembly of claim 7 , wherein the coupling portion has a diameter greater than that of the jack.

13. The RF module assembly of claim 1 , wherein the connection terminal is provided at one side of an edge of the first substrate, and

the RF module is disposed substantially parallel to a side of the first substrate, and the terminal connected to the connection terminal of the first substrate protrudes from a side end portion of the RF module.

14. The RF module assembly of claim 13 , further comprising a main substrate on which the first substrate is mounted,

wherein the RF module comprises at least one fixing end protruding from an outer surface to be fixed to the main substrate.

15. The RF module assembly of claim 14 , further comprising a coupling member coupled with the fixing end and fixing the fixing end to the main substrate.

16. The RF module assembly of claim 15 , further comprising a protrusion protruding from the main substrate to a predetermined height and coupled with the coupling member together with the fixing end.

17. The RF module assembly of claim 13 , further comprising an external case in which the first substrate is mounted,

wherein the RF module comprises at least one fixing end protruding from an outer surface to be fixed to the external case.

18. The RF module assembly of claim 17 , further comprising:

a frame provided at one side inside the external case and having a predetermined thickness; and

a coupling member coupled with the fixing end and fixing the fixing end to the frame.

19. The RF module assembly of claim 1 , wherein the first substrate comprises a receiving portion recessed in one surface of the first substrate to a predetermined depth, and

the RF module is received in the receiving portion.

20. The RF module assembly of claim 19 , further comprising:

a fixing groove provided at one side of the receiving portion; and

a fixing protrusion provided at one side of the housing of the RF module and coupled to the fixing groove to fix the RF module to the receiving portion.

21. A radio frequency (RF) module assembly comprising:

a first substrate on which a predetermined component is mounted, the substrate comprising a connection terminal; and

an RF module mounted on the substrate and processing a predetermined RF signal, the RF module comprising:

a housing forming a body, the housing including a second substrate on which a predetermined component is mounted, the second substrate being electrically connected to the terminal;

a jack receiving and transmitting a predetermined RF signal;

a jack receiving part provided at the housing to allow the jack to be inserted and received in the housing;

a terminal connected to the connection terminal of the substrate; and

an upper cover covering the second substrate;

wherein the jack receiving part includes a coupling portion recessed in the upper cover to a predetermined depth such that a predetermined portion of the jack is placed therein.

22. A radio frequency (RF) module assembly comprising:

a first substrate on which a predetermined component is mounted, the substrate comprising a connection terminal; and

an RF module mounted on the substrate and processing a predetermined RF signal; and

a main substrate on which the first substrate is mounted, wherein the RF module comprises at least one fixing end protruding from an outer surface of the RF module to be fixed to the main substrate;

wherein the RF module comprising:

a housing forming a body;

a jack receiving and transmitting a predetermined RF signal;

a jack receiving part provided at the housing to allow the jack to be inserted and received in the housing; and

a terminal connected to a connection terminal of the first substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SOLUM CO., LTD.
Reel/Frame 048203/0117 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 27, 2008
From: RYU, JONG GI; JANG, IN JONG; WON, KI HOON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 021452/0452 →