Stress-distribution detecting semiconductor package group and detection method of stress distribution in semiconductor package using the same
View Patent ↗A disclosed stress-distribution detecting semiconductor package group includes multiple stress-distribution detecting semiconductor packages each formed by resin-encapsulating a stress detecting semiconductor chip of the same size using an identical resin encapsulation structure. Each stress detecting semiconductor chip includes a piezoelectric element for stress detection and at least two electrode pads electrically connected to the piezoelectric element to measure an electrical property of the piezoelectric element. The piezoelectric elements of the stress detecting semiconductor chips are respectively disposed on the corresponding stress detecting semiconductor chips to be located at different positions from one another when superimposed on a single imaginary semiconductor chip plane having the same plane size as that of the stress detecting semiconductor chips.
1. A stress-distribution detecting semiconductor package group comprising:
a plurality of stress-distribution detecting semiconductor packages each formed by resin-encapsulating a stress detecting semiconductor chip of a same size using an identical resin encapsulation structure,
wherein each of the stress detecting semiconductor chips of the stress-distribution detecting semiconductor packages includes a piezoelectric element for stress detection and at least two electrode pads electrically connected to the piezoelectric element to measure an electrical property of the piezoelectric element, and the piezoelectric elements of the respective stress detecting semiconductor chips are disposed on the corresponding stress detecting semiconductor chips to be located at different positions relative to one another when superimposed on a single imaginary semiconductor chip plane having a same plane size as a plane size of the stress detecting semiconductor chips.
2. The stress-distribution detecting semiconductor package group as claimed in claim 1 , wherein the piezoelectric elements are piezoelectric resistive elements formed of diffusion resistances, and each stress detecting semiconductor chip includes at least four electrode pads electrically connected to the piezoelectric element to measure a resistance of the piezoelectric element by a four-terminal method.
3. A semiconductor-package stress-distribution detection method using the stress-distribution detecting semiconductor package group recited in claim 1 , the semiconductor-package stress-distribution detection method comprising the steps of:
measuring the electrical property of the piezoelectric element for each stress detecting semiconductor chip before resin encapsulation;
resin-encapsulating each stress detecting semiconductor chip to form the stress-distribution detecting semiconductor packages;
measuring the electrical property of the piezoelectric element for each stress-distribution detecting semiconductor package after the resin encapsulation; and
superimposing change in the electrical property of each piezoelectric element from before to after the resin encapsulation on a single imaginary semiconductor chip plane having a same plane size as a plane size of the stress detecting semiconductor chips to thereby detect distribution of stress applied to the stress detecting semiconductor chips due to the resin encapsulation.
4. The semiconductor-package stress-distribution detection method as claimed in claim 3 , wherein the piezoelectric elements are piezoelectric resistive elements formed of diffusion resistances, and each stress detecting semiconductor chip includes at least four electrode pads electrically connected to the piezoelectric element to measure a resistance of the piezoelectric element by a four-terminal method.