IP Library Granted Patent US 7,901,134
Granted Patent B2
US 7,901,134 · App. 12/201,835 · Granted Mar 8, 2011

Semiconductor temperature sensor

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Quick Facts
Patent No.
US 7,901,134
App. No.
12/201,835
Granted
Mar 8, 2011
Kind
B2
Abstract

Provided is a semiconductor temperature sensor having satisfactory linearity of an output voltage with respect to temperature. In a semiconductor temperature sensor ( 1 ), even if the temperature increases and a leakage current is generated at bases of a PNP ( 8 ) and a PNP ( 9 ), a current which flows into emitters of a PNP ( 7 ) and the PNP ( 8 ) is not affected by the leakage current by virtue of a leakage current compensation current of a PNP ( 14 ), and thus, the linearity of the output voltage with respect to the temperature is improved and the accuracy of the semiconductor temperature sensor ( 1 ) with respect to the temperature is improved.

Claims (9)

1. A semiconductor temperature sensor, comprising:

a constant current circuit for causing a constant current to flow;

a Darlington circuit having a plurality of first bipolar transistors which are in Darlington connection, for outputting an output voltage based on the constant current and temperature, the Darlington circuit having a leakage current generated therein at bases of the plurality of first bipolar transistors based on the temperature;

a first current mirror circuit having a plurality of current-mirror connected first transistors, for supplying a current based on the constant current to emitters of the plurality of first bipolar transistors of the Darlington circuit;

a leakage current compensation circuit having a second bipolar transistor, for causing a leakage current compensation current to flow through a base of the second bipolar transistor based on the leakage current; and

a second current mirror circuit having a plurality of current-mirror connected second transistors, for supplying a current based on the leakage current compensation current to the bases of the plurality of first bipolar transistors.

2. A semiconductor temperature sensor according to claim 1 , wherein the plurality of first bipolar transistors and the second bipolar transistor are formed on one semiconductor substrate and are disposed in proximity to one another on a mask layout.

3. A semiconductor temperature sensor according to claim 1 , wherein the second bipolar transistor has a base provided at an input terminal of the second current mirror circuit, an emitter open-circuit, and a collector connected to a ground terminal.

4. A semiconductor temperature sensor according to claim 1 , wherein the second bipolar transistor has a base provided at an input terminal of the second current mirror circuit, and an emitter and a collector connected to a ground terminal.

Assignments (3)
CHANGE OF NAME Recorded Mar 12, 2018
From: SII SEMICONDUCTOR CORPORATION
To: ABLIC INC.
Reel/Frame 045567/0927 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 037783 FRAME: 0166. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Feb 23, 2016
From: SEIKO INSTRUMENTS INC
To: SII SEMICONDUCTOR CORPORATION
Reel/Frame 037903/0928 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2016
From: SEIKO INSTRUMENTS INC
To: SII SEMICONDUCTOR CORPORATION .
Reel/Frame 037783/0166 →