IP Library Granted Patent US 8,536,599
Granted Patent B2
US 8,536,599 · App. 12/201,883 · Granted Sep 17, 2013

Semiconductor light emitting device and method of fabricating thereof

Inventor: Sung Min Choi (Suwon, KR)
Assignee: LG Innotek Co., Ltd.
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Quick Facts
Patent No.
US 8,536,599
App. No.
12/201,883
Granted
Sep 17, 2013
Kind
B2
Abstract

A semiconductor light emitting device has a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer and a second conductive semiconductor layer on the active layer. An oxide layer is disposed around the first semiconductor layer and is provided between the substrate and active layer. The first semiconductor layer has an uneven pattern along the side edge.

Claims (18)

1. A semiconductor light emitting device comprising:

a substrate;

a first semiconductor layer on the substrate, wherein a side surface of a lateral periphery of the first semiconductor layer comprises a recessed portion;

an active layer on the first semiconductor layer;

a second conductive semiconductor layer on the active layer, wherein a portion of the recessed portion is recessed with respect to a side surface of a lateral periphery of the substrate and a side surface of a lateral periphery of the second conductive semiconductor layer; and

an oxide layer disposed on a side surface of the recessed portion around the first semiconductor layer,

wherein the oxide layer is provided between the substrate and the active layer,

wherein a portion of a top surface of the oxide layer is in contact with a bottom surface of the active layer,

wherein the oxide layer is on a top surface of the substrate, and

wherein the first semiconductor layer comprises a buffer layer and a first conductive semiconductor layer.

2. The semiconductor light emitting device of claim 1 , wherein a surface of the oxide layer comprises an uneven pattern, which is in contact with a side surface of the first semiconductor layer.

3. The semiconductor light emitting device of claim 1 , wherein the first semiconductor layer comprises an n-type semiconductor layer.

4. The semiconductor light emitting device of claim 2 , wherein the uneven pattern comprises at least one of a semi-circular form, a lens form, a curved form, a polygonal form, and a horn form.

5. The semiconductor light emitting device of claim 1 , wherein the oxide layer has an approximate thickness of 1 μm to 7 μm from a top surface of the substrate.

6. The semiconductor light emitting device of claim 2 , wherein an uneven pattern depth between a concave surface of the uneven pattern and a convex surface of the uneven pattern is in an approximate range between 1 μm and 50 μm.

7. The semiconductor light emitting device of claim 1 , wherein at least one of an electrode layer, a transparent electrode layer, an n-type semiconductor layer, and a reflective electrode layer is disposed on the second conductive semiconductor layer.

8. The semiconductor light emitting device of claim 2 , wherein the uneven pattern has a thickness approximately equal to the first semiconductor layer.

9. The semiconductor light emitting device of claim 2 , wherein the uneven pattern comprises a periodical pattern or a random pattern.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2025
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: BOE HC SEMITEK LIMITED(HENGQIN)
Reel/Frame 070521/0027 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2008
From: CHOI, SUNG MIN
To: LG INNOTEK CO., LTD.
Reel/Frame 021512/0208 →
Priority Claims (1)
KR 10-2007-0088285 · Aug 31, 2007 · national
Continuity (1)
Related Publication 20090057703A1 · Mar 5, 2009