Electronic device and method

1. A varistor pre-assembly, comprising: an electrode formable structure and an unsintered mass proximate to the electrode formable structure, wherein the electrode formable structure comprises a material having a melting point that is within a determined temperature relative to a sintering temperature of the unsintered mass; and wherein the electrode formable structure and unsintered mass form a varistor when simultaneously subjected to the sintering temperature that is less than about 1000 degrees Celsius.

2. The varistor pre-assembly of claim 1 , wherein the electrode formable structure consists essentially of silver.

3. The varistor pre-assembly of claim 2 , wherein the electrode formable structure further comprises one or more of palladium, platinum, or gold that is present in an amount or a ratio such the melting temperature of the electrode formable structure is controlled relative to the sintering temperature of the unsintered mass so that co-firing of the electrode formable structure and the unsintered mass at about the sintering temperature produces a varistor.

4. The varistor pre-assembly of claim 1 , wherein the electrode formable structure is free of platinum, palladium, or both platinum and palladium.

5. The varistor pre-assembly of claim 1 , wherein the electrode formable structure comprises a metal having a melting point of less than about 950 degrees Celsius.

6. The varistor pre-assembly of claim 1 , wherein the unsintered mass comprises zinc oxide.

7. The varistor pre-assembly of claim 6 , wherein the unsintered mass further comprises a sintering additive and a grain growth inhibitor additive.

8. The varistor pre-assembly of claim 7 , wherein the sintering additive comprises one or both of Li 2 CO 3 and LiBiO 3 .

9. The varistor pre-assembly of claim 8 , wherein the grain growth inhibitor additive comprises one or more of SiO 2 , Sb 2 O 3 , CaO, Al 2 O 3 , MgO, or Fe 2 O 3 .

10. A varistor formed from the varistor pre-assembly of claim 1 , wherein the varistor pre-assembly is sintered to form a nano-structured varistor comprising a sintered mass and an electrode, wherein the sintered mass comprises a plurality of nano-sized cores and a grain boundary layer disposed between each of the plurality of cores.

11. The varistor of claim 10 , wherein an average distance from one core to an adjacent core in the plurality of cores is less than about 500 nanometers.

12. The varistor of claim 10 , wherein an average diameter of the cores is less than about 500 nanometers.

13. The varistor of claim 10 , wherein an average thickness of the grain boundary layer is less than about 400 nanometers.

14. The varistor of claim 10 , wherein an average thickness of the nano-structured sintered mass is less than about 1000 micrometers.

15. The varistor of claim 10 , wherein the varistor has a dielectric constant of less than about 1000.

16. The varistor of claim 10 , wherein the varistor has a sintered density of more than about 95%.

17. The varistor of claim 10 , wherein the varistor has a leakage current of less than about 10 −5 Ampere per square centimeter.

18. The varistor of claim 10 , wherein the varistor has a breakdown voltage of greater than about 0.5 kilo Volt per millimeter.

19. The varistor of claim 10 , wherein the varistor responds to electrical voltage overstress of about 10 kilo Volts by shunting electrical current to a ground.

20. The varistor of claim 10 , wherein the varistor protects against an overstress above a threshold voltage of about more than about 250 volts.

21. A method, comprising: sintering a unsintered mass at a temperature profile that is sufficiently high that a sintered mass is formed from the unsintered mass, and the temperature profile is less than about 1050 degrees Celsius; and forming one or more electrodes coupled to the sintered mass simultaneously with the sintering, and thereby to form a varistor having one or more electrodes coupled to, and in electrical communication through, the sintered mass.

22. The method of claim 21 , further comprising selecting the electrode to be a metal having a melting point within a determined temperature range relative to the temperature profile.