Light emitting diode package having heat dissipating slugs
View Patent ↗A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.
1. A light emitting diode package, comprising:
first and second heat dissipating slugs formed of a conductive material and spaced apart from and not directly electrically connected to each other;
a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and
a light emitting diode die electrically connected to the first and second heat dissipating slugs,
wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body.
2. The light emitting diode package as claimed in claim 1 , wherein portions of the first and second heat dissipating slugs which are exposed through the side surfaces of the package main body include a plurality of fins.
3. The light emitting diode package as claimed in claim 1 , wherein the package main body has a cavity for exposing upper surfaces of the first and second heat dissipating slugs, and the light emitting diode die is mounted on the upper surface of the first heat dissipating slug exposed through the cavity.
4. The light emitting diode package as claimed in claim 3 , further comprising a bonding wire for electrically connecting the light emitting diode die to the second heat dissipating slug.
5. The light emitting diode package as claimed in claim 1 , wherein the package main body is formed of transparent resin.
6. The light emitting diode package as claimed in claim 1 , wherein the first heat dissipating slug has a cavity forming a reflective surface, and the light emitting diode die is mounted in the cavity of the first heat dissipating slug.
7. The light emitting diode package as claimed in claim 1 , further comprising a metal reflector positioned on the first and second heat dissipating slugs, wherein the light emitting diode die is mounted inside of the metal reflector.
8. The light emitting diode package as claimed in claim 7 , wherein the package main body is attached to the metal reflector to support the metal reflector.
9. The light emitting diode package as claimed in claim 1 , wherein the first and second heat dissipating slugs are partially embedded in the package main body.
10. The light emitting diode package as claimed in claim 1 , wherein the package main body comprises a first side and a second side opposite to the first side along a first direction, and the first and second heat dissipating slugs are partially embedded in the package main body between the first side and the second side.
11. The light emitting diode package as claimed in claim 10 , wherein the first heat dissipating slug extends outside the first side of the package main body, and the second heat dissipating slug extends outside the second side of the package main body.
12. The light emitting diode package as claimed in claim 10 , wherein the package main body comprises a third side, and the first and second heat dissipating slugs are partially covered by the package main body and extend from the third side of the package body in a second direction substantially perpendicular to the first direction.
13. A light emitting diode package, comprising:
first and second heat dissipating slugs formed of a conductive material and spaced apart from each other;
a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and
a light emitting diode die electrically connected to the first and second heat dissipating slugs,
wherein the respective first heat dissipating slug and the second heat dissipating slug are exposed to and extend outside the package main body through a lower surface and a side surface of the package main body.
14. The light emitting diode package of claim 13 , wherein the light emitting diode die is disposed on the first heat dissipating slug, and the light emitting diode die and the second heat dissipating slug are connected.
15. A light emitting diode package, comprising:
first and second heat dissipating slugs formed of a conductive material and spaced apart from each other;
a package main body coupled to the first heat dissipating slug and the second heat dissipating slug to support the first heat dissipating slug and the second heat dissipating slug; and
a light emitting diode die electrically connected to the first heat dissipating slug and the second heat dissipating slug,
wherein the respective first heat dissipating slug and the second heat dissipating slug are exposed to outside the package main body through a lower surface and a side surface of the package main body, and
wherein the light emitting diode die is disposed on the first heat dissipating slug and the light emitting diode die and the second heat dissipating slug are connected.