Image sensor and method of manufacturing the same
View Patent ↗An image sensor includes a pixel array including a photodiode, a peripheral region including a logic circuit, and an isolation region formed between the pixel array and the peripheral region and formed under the peripheral region to electrically isolate the pixel array from the peripheral region.
1. A method of manufacturing an image sensor comprised of a pixel array region, a first isolation region, a second isolation region, and a peripheral region, the method comprising:
forming a pixel array within the pixel array region;
forming the first isolation region under the peripheral region and between the pixel array and the peripheral region to electrically isolate the pixel array from the peripheral region;
forming the second isolation region on a partial upper side of the first isolation region to electrically isolate the pixel array from the peripheral region; and
forming a logic circuit within the peripheral region,
wherein the forming the pixel array comprises:
forming a red photodiode on a sub-epitaxial layer of a first conductivity by performing implantation of ions of a second conductivity;
forming a first epitaxial layer of the first conductivity on the red photodiode;
forming a first plug in a portion of the first epitaxial layer by performing implantation of ions of the second conductivity so as to be electrically connected to the red photodiode; and
forming a green photodiode on the first epitaxial layer by performing implantation of ions of the second conductivity.
2. The method of claim 1 , wherein the forming of the first isolation region is performed together with the forming of the red photodiode, the first plug, or the green photodiode.
3. The method of claim 1 , further comprising:
forming a second epitaxial layer on the first epitaxial layer having the green photodiode formed thereon;
forming a second plug in a portion of the second epitaxial layer by performing implantation of ions of the second conductivity so as to be electrically connected with the first plug; and
forming a blue photodiode on the second epitaxial layer having the second plug formed thereon by performing implantation of ions of the second conductivity.
4. The method of claim 3 , wherein the forming of the second plug is performed together with the forming of the second isolation region.
5. A method of manufacturing an image sensor comprised of a pixel array region, an isolation region, and a peripheral region, the method comprising:
forming a pixel array within the pixel array region;
forming a first isolation region to be electrically isolated from the pixel array within the isolation region and the peripheral region;
forming a second isolation region on a partial upper side of the first isolation region; and
forming a logic circuit within the peripheral region,
wherein the forming of the first isolation region comprises:
forming a red isolation region on a sub-epitaxial layer of a first conductivity by performing implantation of ions of a second conductivity;
forming an epitaxial layer of the first conductivity on the red isolation region; and
forming a first plug isolation region on the epitaxial layer by performing implantation of ions of the second conductivity, and
wherein the forming the second isolation region comprises:
forming a green isolation region in a portion of the first plug isolation region by performing implantation of ions of the second conductivity.
6. The method of claim 5 , wherein the forming the pixel array comprises:
forming a red photodiode on a sub-epitaxial layer of a first conductivity by performing implantation of ions of a second conductivity;
forming a first epitaxial layer of the first conductivity on the red photodiode;
forming a first plug in a portion of the first epitaxial layer by performing implantation of ions of the second conductivity so as to be electrically connected to the red photodiode; and
forming a green photodiode on the first epitaxial layer by performing implantation of ions of the second conductivity.
7. The method of claim 6 , wherein the forming of the first isolation region is performed together with the forming of the red photodiode, the first plug, or the green photodiode.
8. The method of claim 6 , further comprising:
forming a second epitaxial layer on the first epitaxial layer having the green photodiode formed thereon;
forming a second plug in a portion of the second epitaxial layer by performing implantation of ions of the second conductivity so as to be electrically connected with the first plug; and
forming a blue photodiode on the second epitaxial layer having the second plug formed thereon by performing implantation of ions of the second conductivity.
9. The method of claim 8 , wherein the forming the second plug is performed together with the forming the second isolation region.