PLASMA ENHANCED CHEMICHAL VAPOR DEPOSITION APPARATUS AND METHOD
A substrate processing system includes a deposition chamber and a plurality of tubular electrodes positioned within the deposition chamber defining plasma regions adjacent thereto.
1 . A method of forming a film layer on at least one substrate inside a deposition chambers comprising the steps of:
generating at least one plasma region having a relatively high intensity between a plurality of rod electrodes and away from at least one substrate and at least one plasma region having a relatively low intensity adjacent to the at least one substrate by driving adjacent rod electrodes out of phase from one another;
introducing a reactant including film layer material into the at least one region of relatively low intensity plasma;
depositing the film layer material onto the at least one substrate.
2 . The method as claimed in claim 1 , wherein RF power is supplied to each end of the adjacent rod electrodes.
3 . The method as claimed in claim 1 , wherein the adjacent rod electrodes have a parallel inductor attached to each longitudinal end.
4 . The method as claimed in claim 1 , wherein RF power is supplied in the 27-81 MHz excitation frequency range to drive the adjacent rod electrodes out of phase from one another.
5 . The method as claimed in claim 1 , wherein the step of introducing a reactant comprises introducing the reactant including film layer material into the at least one region of relatively low intensity plasma region through at least one of the plurality of rod electrodes.
6 . The method as claimed in claim 5 , wherein the plurality of rod electrodes have internal lumens and apertures that connect the internal lumens to the deposition chamber, wherein the apertures are oriented toward the at least one substrate and away from the plurality of rod electrodes.
7 . The method as claimed in claim 1 , wherein the plurality of rod electrodes define an electrode plane and the step of introducing a reactant comprises introducing a reactant including film layer material into the at least one relatively low intensity plasma region through at least one rod electrode and in a direction that is substantially perpendicular to the electrode plane.
8 . The method as claimed in claim 1 , wherein the step of introducing a reactant comprises introducing a substantially pure reactant including film layer material into the at least one relatively low intensity plasma region.
9 . The method as claimed in claim 7 , wherein the step of introducing a reactant comprises introducing a substantially pure silane into the at least one relatively low intensity plasma region.
10 . The method as claimed in claim 1 , further comprising the step of:
evacuating exhaust from the deposition chamber.
11 . The method as claimed in claim 10 , wherein the step of evacuating exhaust from the deposition chamber comprises evacuating exhaust through at least one of the plurality of rod electrodes.
12 . The method as claimed in claim 10 wherein the steps of introducing a reactant and evacuating exhaust comprises introducing the reactant including film layer material into the at least one region of relatively low intensity plasma region and evacuating exhaust through adjacent rod electrodes.
13 . The method as claimed in claim 10 , further comprising the steps of:
measuring the amount of film layer material in the exhaust; and
adjusting a reactant input rate in response to the measured amount of film layer material in the exhaust.
14 . The method as claimed in claim 13 , wherein the step of adjusting the reactant input rate comprises adjusting the reactant input rate in response to the measured amount of film layer material in the exhaust while continuing to introduce the reactant.
15 . The method as claimed in claim 10 , further comprising the steps of:
measuring the pressure within the deposition chamber; and
adjusting the exhaust rate in response to the measured pressure within the deposition chamber while continuing to introduce the reactant.
16 . The method as claimed in claim 1 , wherein the at least one substrate comprises a first and second substrate.
17 . The method as claimed in claim 16 , further comprising the step of:
positioning the first and second substrates such that the at least one plasma region having a relatively low intensity is between each of the first and second substrates and the at least one plasma region having a relatively high intensity.
18 . The method as claimed in claim 16 , further comprising the step of:
positioning the first and second substrates on opposite sides of the plasma region having a relatively high intensity.
19 . A method of forming a film on at least one substrate inside a deposition chamber, comprising the steps of:
generating a plasma within a deposition chamber with at least one region of relatively high intensity between a plurality of rod electrodes and away from the at least one substrate and at least one region of relatively low intensity plasma adjacent to the at least one substrate by driving adjacent rod electrodes out of phase from one another;
introducing a reactant including film layer material into the at least one relatively low intensity plasma region adjacent to the at least one substrate through at least one of the plurality of rod electrodes having internal lumens and apertures that connect the internal lumens to the deposition chamber, wherein the apertures are oriented toward the at least one substrate and away from the plurality of rod electrodes; and
depositing the film layer material onto the at least one substrate.
20 . The method as claimed in claim 19 , wherein RF power is supplied to each end of the adjacent rod electrodes.
21 . The method as claimed in claim 19 , wherein the adjacent rod electrodes have a parallel inductor attached to each longitudinal end.
22 . The method as claimed in claim 19 , further comprising the steps of:
evacuating exhaust from the deposition chamber;
measuring the amount of film layer material in the exhaust; and
adjusting the reactant input rate in response to the measured amount of film layer material in the exhaust.
23 . The method as claimed in claim 22 wherein the step of evacuating exhaust from the deposition chamber comprises evacuating the exhaust through at least one of the plurality of rod electrodes.
24 . The method as claimed in claim 23 wherein the steps of introducing a reactant and evacuating exhaust comprise introducing the reactant including film layer material into the at least one region of relatively low intensity plasma region and evacuating exhaust through adjacent rod electrodes.
25 . The method as claimed in claim 22 , further comprising the steps of
measuring the pressure within the deposition chamber; and
adjusting the exhaust rate in response to the measured pressure within the deposition chamber while continuing to introduce the reactant.
26 . The method as claimed in claim 21 wherein the adjacent rod electrodes are driven at both longitudinal ends.
27 . The method as claimed in claim 19 wherein the adjacent rod electrodes are driven by a power supply operably connected to the plurality of rod electrodes and wherein RF power is supplied in the 27-81 MHz excitation frequency range.