SOLID DISPERSION, PROCESS OF PRODUCING SOLID DISPERSION, AND HEAT DEVELOPABLE PHOTOSENSITIVE MATERIAL
A process of producing a solid dispersion of an organic compound comprising a step in which after solid dispersing an organic compound, a temperature is elevated stepwise to subject the dispersion to heat treatment.
1 . A process of producing a solid dispersion of an organic compound, comprising:
solid dispersing an organic compound, so as to form a dispersion; and then heating the dispersion,
wherein the heating comprises a step in which a temperature is elevated stepwise to subject the dispersion to a heat treatment,
wherein
(A) the stepwise elevation comprises at least two stages defined by (B) set forth below, and
(B) wherein the stepwise elevation comprises a first stage of keeping the dispersion from 30 to 50° C., and then a second stage of elevating the temperature to 60° C. or higher.
2 . The process according to claim 1 ,
wherein each stage in the stepwise elevation is for five minutes or longer.
3 . The process according to claim 1 ,
wherein the organic compound is a photographically useful organic compound.
4 . The process according to claim 3 ,
wherein the photographically useful organic compound is a polyhalogen compound, a bisphenol compound or a compound capable of forming a hydrogen bond to a bisphenol compound.
5 . A solid dispersion of an organic compound prepared by the process according to claim 1 .
6 . A heat developable photosensitive material, comprising:
a support; and
a photosensitive silver halide, a non-photosensitive organic silver salt, a reducing agent and a binder on one surface of the support,
wherein the heat developable photosensitive material is produced through a step of applying a coating solution containing the solid dispersion of an organic compound according to claim 5 and then drying it.
7 . The heat developable photosensitive material according to claim 6 ,
wherein the organic compound is a polyhalogen compound, a bisphenol compound or a compound capable of forming a hydrogen bond to a bisphenol compound.