IP Library Granted Patent US 7,965,329
Granted Patent B2
US 7,965,329 · App. 12/206,919 · Granted Jun 21, 2011

High gain read circuit for 3D integrated pixel

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Quick Facts
Patent No.
US 7,965,329
App. No.
12/206,919
Granted
Jun 21, 2011
Kind
B2
Abstract

An image sensor includes (a) a first wafer having (i) a photosensitive area; (ii) a charge-to-voltage conversion region; (b) a second wafer having (i) a first amplifier that receives a signal from the charge-to-voltage conversion region; (c) an electrical interconnect connecting the charge-to-voltage conversion region to an input of the amplifier; (d) an electrically biased shield at least partially enclosing at least a portion of the electrical interconnect.

Claims (25)

1. An image sensor comprising:

(a) a first wafer comprising:

(i) a photosensitive area;

(ii) a charge-to-voltage conversion region;

(b) a second wafer comprising:

(i) a first amplifier that receives a signal from the charge-to-voltage conversion region;

(c) an electrical interconnect connecting the charge-to-voltage conversion region to an input of the amplifier;

(d) an electrically biased shield at least partially enclosing at least a portion of the electrical interconnect.

2. The image sensor as in claim 1 , wherein the electrical bias on the shield is an output from the first amplifier.

3. The image sensor as in claim 2 further comprising a second amplifier in which the input of the second amplifier is the output of the first amplifier and the output of the second amplifier biases the electrical shield.

4. The image sensor as in claim 3 , wherein the second amplifier is an amplifier with a gain greater than one.

5. The image sensor as in claim 3 , wherein the second amplifier is a charge pump circuit.

6. An imaging device comprising:

an image sensor comprising:

(a) a first wafer comprising:

(i) a photosensitive area;

(ii) a charge-to-voltage conversion region;

(b) a second wafer comprising:

(i) a first amplifier that receives a signal from the charge-to-voltage conversion region;

(c) an electrical interconnect connecting the charge-to-voltage conversion region to an input of the amplifier;

(d) an electrically biased shield at least partially enclosing at least a portion of the electrical interconnect.

7. The imaging device as in claim 6 , wherein the electrical bias on the shield is an output from the first amplifier.

8. The imaging device as in claim 7 further comprising a second amplifier in which the input of the second amplifier is the output of the first amplifier and the output of the second amplifier biases the electrical shield.

9. The imaging device as in claim 8 , wherein the second amplifier is an amplifier with a gain greater than one.

10. The imaging device as in claim 8 , wherein the second amplifier is a charge pump circuit.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2011
From: EASTMAN KODAK COMPANY
To: OMNIVISION TECHNOLOGIES, INC.
Reel/Frame 026227/0213 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2008
From: MCCARTEN, JOHN P.; SUMMA, JOSEPH R.; ANDERSON, TODD J.; TIVARUS, CRISTIAN A.
To: EASTMAN KODAK COMPANY
Reel/Frame 021500/0133 →