Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source
View Patent ↗A two-dimensional light source includes a base substrate having holes, wires disposed on a lower surface of the base substrate, a light emitting diode (LED) chip disposed on an upper surface of the base substrate, plugs that connect two electrodes of the LED chip to the wires through the holes, a buffer layer covering the LED chip, and an optical layer that is disposed on the buffer layer and has an optical pattern formed at a portion of the optical layer corresponding to the LED chip.
1. A light source comprising:
a base substrate having a lower surface, an upper surface and a hole, the hole penetrating the base substrate;
a wire member disposed on the lower surface of the base substrate;
a light emitting diode (LED) chip disposed on the upper surface of the base substrate, the LED chip having an electrode member;
a plug member disposed in the hole and connecting the electrode member to the wire member through the hole;
a buffer layer covering the LED chip; and
an optical layer disposed on the buffer layer, the optical layer includes a pattern member disposed at a portion of the optical layer corresponding to the LED chip,
wherein the base substrate includes a printed circuit board (PCB) substrate and a heat radiating substrate disposed on the PCB substrate, the wire member is disposed on the PCB substrate, and the LED chip is disposed on the heat radiating substrate.
2. The light source of claim 1 , wherein the heat radiating substrate is formed with a metallic material.
3. The light source of claim 2 , further comprising a chip base provided on the heat radiating substrate that insulates between the electrode member of the LED chip and the heat radiating substrate.
4. The light source of claim 3 , wherein the chip base has a hole and the plug member is connected to the electrode member of the LED chip through the hole of the chip base.
5. The light source of claim 2 , further comprising a coating film which is disposed on at least an inner surface of the hole of the heat radiating substrate and insulates between the plug member and the heat radiating substrate.
6. The light source of claim 1 , wherein the pattern member comprises an embossed lens.
7. The light source of claim 6 , wherein the embossed lens is a convex lens.
8. The light source of claim 1 , wherein the LED chip is bonded to the plug member by a flip chip bonding.
9. The light source of claim 1 , wherein the buffer layer has a planarized upper surface.