Potassium monopersulfate solutions
View Patent ↗A composition comprising a solution of potassium monopersulfate having an active oxygen content of from about 3.4% to about 6.8% and a process for its preparation including neutralization with an alkaline material is disclosed.
1. An improved method of microetching a surface wherein the improvement comprises contacting the surface to be etched with a microetching solution containing potassium monopersulfate solution having an active oxygen content of from about 3.4% to about 6.8% by weight and a maximum SO 4 content of 5.5% by weight.
2. The method of claim 1 wherein the surface to be etched is a metal coated semiconductor or printed wiring board.
3. The method of claim 1 wherein the surface to be etched is clad with copper or copper alloy.
4. The method of claim 1 wherein the solution has a copper loading capacity of at least 25 g copper per liter of solution.
5. The method of claim 1 wherein the solution has an active oxygen content of from about 3.5% to about 6.8%.
6. An improved method of mechanically polishing a substrate wherein the improvement comprises use of a polishing slurry containing a potassium monopersulfate solution having an active oxygen content of from about 3.4% to about 6.8% by weight and a maximum SO 4 content of 5.5% by weight.
7. An improved method of treating recreational and ornamental water wherein the improvement comprises use of a potassium monopersulfate solution having an active oxygen content of from about 3.4% to about 6.8% by weight and a maximum SO 4 content of 5.5% by weight.