IP Library Granted Patent US 7,755,903
Granted Patent B2
US 7,755,903 · App. 12/209,651 · Granted Jul 13, 2010

Heat dissipation apparatus

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Quick Facts
Patent No.
US 7,755,903
App. No.
12/209,651
Granted
Jul 13, 2010
Kind
B2
Abstract

A heat dissipating apparatus includes a base, a heat sink received in the base, and a retaining cover attached to the base. The retaining cover defines two crossing slots for cooperatively forming at least one flap. Each free portion of flap has a free portion. The free portion of each flap elastically curves towards the heat sink to bias the heat sink towards the base.

Claims (23)

1. A heat dissipating apparatus comprising:

a base;

a heat sink received in the base, and

a retaining cover attached to the base, the retaining cover defining two crossing slots for cooperatively forming at least one flap, each flap has a free portion, the free portion of each flap elastically curving towards the heat sink to bias the heat sink towards the base;

wherein the retaining cover includes a latching member pivotably attached thereon, a retaining notch is defined in the latching member; and a post protrudes from the base for engaging with the retaining notch.

2. The heat dissipating apparatus of claim 1 , wherein the retaining cover is pivotally attached to the base.

3. The heat dissipating apparatus of claim 1 , wherein a width of the notch decreases from an out side edge to where the retaining notch engages with the post.

4. The heat dissipating apparatus of claim 1 , wherein the pivot point of the retaining cover and the base is positioned on an edge of the cover opposite to the latching member.

5. The heat dissipating apparatus of claim 1 , wherein the retaining cover is partially depressed at a crossing portion of the slots due to the curve of the at least one flap.

6. The heat dissipating apparatus of claim 1 , wherein the slots are perpendicular to each other, and the at least one flap comprises four corner-shaped flaps in four quadrants.

7. A heat dissipating assembly comprising:

a motherboard;

a heat generating element arranged on the motherboard;

a base fixed on the motherboard;

a heat sink received in the base, the heat sink configured for contacting the heat generating element; and

a retaining cover attached to the base, at least one inner flap formed on the retaining cover, each flap having a free end portion, the free end portion of each flap urging the heat sink in contact with the heat generating element,

wherein the retaining cover defines two crossing slots, and four corner-shaped flaps are formed by defining of the slots in four quadrants.

8. The heat dissipating assembly of claim 7 , wherein the retaining cover is pivotally attached to the base.

9. The heat dissipating assembly of claim 8 , wherein the retaining cover includes a latching member pivotally attached thereto, a retaining notch is defined in the latching member; a post protrudes from the base for corresponding with the retaining notch.

10. The heat dissipating assembly of claim 9 , wherein a width of the retaining notch decreases from an outer edge to where the retaining notch engages with the post.

11. The heat dissipating assembly of claim 9 , wherein the pivot point of the retaining cover and the base is positioned on an edge of the retaining cover opposite to the latching member.

12. The heat dissipating assembly of claim 7 , wherein the free portions are curved to elastically abut the heat sink, and the retaining cover is partially depressed at an crossing portion of the slots due to the curve of the free portion.

13. The heat dissipating assembly of claim 7 , wherein the slots are perpendicular to each other.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2018
From: HON HAI PRECISION INDUSTRY CO., LTD.
To: CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.
Reel/Frame 045281/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2008
From: TSAI, LUNG-SHENG; CHEN, LI-PING
To: HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 021524/0280 →