Semiconductor device and manufacturing method thereof
View Patent ↗A semiconductor device includes an element formed on a substrate, at least one insulating film formed on the substrate, and a seal ring formed in the insulating film so as to surround a region where the element is formed and to extend through the insulating film. The semiconductor device further includes a void region including a void and formed in the insulating film in a region located outside the seal ring when viewed from the element.
1. A semiconductor device, comprising:
an element formed on a substrate;
an insulating film formed on the substrate;
a seal ring formed in the insulating film so as to surround a region where the element is formed and to extend through the insulating film; and
a void region including at least one void and formed in the insulating film in a region located outside the seal ring when viewed from the element, wherein:
the insulating film has a layered structure of a plurality of interlayer insulating films, and includes a via formed in at least one of the plurality of interlayer insulating films and electrically connected to the element, and an interconnect formed in at least one of the plurality of interlayer insulating films and electrically connected to the element, the seal ring includes a seal via formed in the interlayer insulating film in which the via is formed, and a seal interconnect formed in the interlayer insulating film in which the interconnect is formed, and the void region includes a void formed at least in the interlayer insulating film in which the seal interconnect is formed,
the interconnect and the via are respectively formed in different interlayer insulating films of the plurality of interlayer insulating films, and
the interlayer insulating film in which the interconnect is formed is made of a film having a lower dielectric constant than that of the interlayer insulating film in which the via is formed.
2. The semiconductor device according to claim 1 , wherein a width of the void is smaller than that of the interconnect.
3. The semiconductor device according to claim 1 , further comprising a dual damascene interconnect in which the via and the interconnect are formed integrally.
4. The semiconductor device according to claim 1 , further comprising a passivation film formed on the insulating film, wherein the seal ring is formed so as to extend through the insulating film and the passivation film, and the void region further includes another void formed in the passivation film in a region located outside the seal ring when viewed from the element.
5. The semiconductor device according to claim 4 , wherein the passivation film has a layered structure of a plurality of films.
6. The semiconductor device according to claim 1 , wherein the void region includes a plurality of voids discontinuously arranged in a thickness direction of the insulating film.
7. The semiconductor device according to claim 1 , wherein the void region includes a plurality of voids arranged so as to be adjacent to each other in a thickness direction of the insulating film.
8. The semiconductor device according to claim 1 , wherein the void region includes a void formed outside the seal ring when viewed from the element so as to continuously surround the seal ring without a gap.
9. The semiconductor device according to claim 1 , wherein the void region includes a plurality of voids formed outside the seal ring when viewed from the element so as to discontinuously surround the seal ring.
10. The semiconductor device according to claim 1 , further comprising at least one other void region including at least one void and formed outside the void region when viewed from the element.
11. The semiconductor device according to claim 10 , wherein the at least one other void region includes a void formed outside the seal ring when viewed from the element so as to continuously surround the seal ring without a gap.
12. The semiconductor device according to claim 10 , wherein the at least one other void region includes a plurality of voids formed outside the seal ring when viewed from the element so as to discontinuously surround the seal ring.
13. The semiconductor device according to claim 10 , wherein each of the void region and the at least one other void region includes a plurality of voids formed outside the seal ring when viewed from the element so as to discontinuously surround the seal ring, and a space between the plurality of voids in the void region and a space between the plurality of voids in the at least one other void region are arranged so as not to be adjacent to each other in a direction perpendicular to an extending direction of the seal ring.
14. The semiconductor device according to claim 9 , wherein at least one of the plurality of voids arranged so as to surround the seal ring has a different dimension in an extending direction of the seal ring from that of the remainder of the voids.
15. A semiconductor device, comprising:
an element formed on a substrate;
an insulating film formed on the substrate;
a seal ring formed in the insulating film so as to surround a region where the element is formed and to extend through the insulating film; and
a void region including at least one void and formed in the insulating film in a region located outside the seal ring when viewed from the element, wherein:
the insulating film has a layered structure of a plurality of interlayer insulating films, and includes a via formed in at least one of the plurality of interlayer insulating films and electrically connected to the element, and an interconnect formed in at least one of the plurality of interlayer insulating films and electrically connected to the element, the seal ring includes a seal via formed in the interlayer insulating film in which the via is formed, and a seal interconnect formed in the interlayer insulating film in which the interconnect is formed, and the void region includes a void formed at least in the interlayer insulating film in which the seal interconnect is formed,
a part of the interlayer insulating film in which the interconnect is formed has a lower dielectric constant than that of another part of the interlayer insulating film in which the via is formed.
16. The semiconductor device according to claim 15 , further comprising a passivation film formed on the insulating film, wherein the seal ring is formed so as to extend through the insulating film and the passivation film, and the void region further includes another void formed in the passivation film in a region located outside the seal ring when viewed from the element.
17. The semiconductor device according to claim 15 , wherein the void region includes a plurality of voids discontinuously arranged in a thickness direction of the insulating film.
18. The semiconductor device according to claim 15 , wherein the void region includes a void formed outside the seal ring when viewed from the element so as to continuously surround the seal ring without a gap.
19. The semiconductor device according to claim 15 , further comprising at least one other void region including at least one void and formed outside the void region when viewed from the element.
20. The semiconductor device according to claim 19 , wherein the at least one other void region includes a void formed outside the seal ring when viewed from the element so as to continuously surround the seal ring without a gap.
21. The semiconductor device according to claim 15 , wherein the void region includes a plurality of voids arranged so as to be adjacent to each other in a thickness direction of the insulating film.
22. The semiconductor device according to claim 15 , wherein the void region includes a plurality of voids formed outside the seal ring when viewed from the element so as to discontinuously surround the seal ring.
23. The semiconductor device according to claim 19 , wherein the at least one other void region includes a plurality of voids formed outside the seal ring when viewed from the element so as to discontinuously surround the seal ring.
24. The semiconductor device according to claim 19 , wherein each of the void region and the at least one other void region includes a plurality of voids formed outside the seal ring when viewed from the element so as to discontinuously surround the seal ring, and a space between the plurality of voids in the void region and a space between the plurality of voids in the at least one other void region are arranged so as not to be adjacent to each other in a direction perpendicular to an extending direction of the seal ring.
25. The semiconductor device according to claim 22 , wherein at least one of the plurality of voids arranged so as to surround the seal ring has a different dimension in an extending direction of the seal ring from that of the remainder of the voids.