Image sensor package and camera module utilizing the same
An image sensor package includes an image sensor chip, a sidewall, an encapsulation glass, conductive material, and a plurality of solder balls. The image sensor chip comprises a photosensitive area, a non-photosensitive area surrounding the photosensitive area, and a plurality of bonding pads formed on the non-photosensitive area. The sidewall is located on the non-photosensitive are and defines a plurality of first through holes aligned with and corresponding to the bonding pads. The encapsulation glass is located on the sidewall. A plurality of solder balls are formed on the encapsulation glass aligned with the bonding pads, respectively. The encapsulation glass defines a plurality of second through holes each corresponding to a bonding pad and a corresponding solder ball. The image sensor package further comprises a conductive material through which the first and second through holes penetrate.
1. An image sensor package comprising:
an image sensor chip comprising: a photosensitive area, a non-photosensitive area surrounding the photosensitive area, and a plurality of bonding pads formed on the non-photosensitive area;
a sidewall located on the non-photosensitive area and defining a plurality of first through holes aligned with and corresponding to the bonding pads;
an encapsulation glass located on the sidewall; and
a plurality of solder balls formed on the encapsulation glass aligned with the bonding pads, respectively, the encapsulation glass defining a plurality of second through holes each connecting a bonding pad and a corresponding solder ball, and the image sensor package further comprising a conductive material through which the first and second through holes penetrate.
2. The image sensor package as claimed in claim 1 , wherein the encapsulation glass is an infrared cut filter.
3. The image sensor package as claimed in claim 1 , wherein the sidewall is made from an insulative light-impervious material.
4. An camera module comprising:
an image sensor chip comprising: a photosensitive area, a non-photosensitive area surrounding the photosensitive area, and a plurality of bonding pads formed on the non-photosensitive area;
a sidewall located on the non-photosensitive area and defining a plurality of first through holes aligned with and corresponding to the bonding pads;
an encapsulation glass located on the sidewall;
a plurality of solder balls formed on the encapsulation glass aligned with the bonding pads, respectively, the encapsulation glass defining a plurality of second through holes each corresponding to a bonding pad and a corresponding solder ball, the camera module further comprising a conductive material through which the first and second through holes penetrate;
a lens holder comprising a hollow first portion and a hollow second portion coaxially coupled thereto;
a lens received in the hollow first portion of the lens holder;
a circuitized board having a first connecting surface and a second surface facing away from the first connecting surface and defining an opening, formed with a plurality of first base pads on a surface thereof, wherein the lens holder is located on the opposite surface of the circuitized board with its optical axis aligning with the opening, and the base pad contacts the solder balls.
5. The camera module as claimed in claim 4 , wherein the opening is larger than the photosensitive area.
6. The camera module as claimed in claim 4 , wherein the circuitized board comprises a plurality of second base pads electrically coupling to an external circuit.
7. The camera module as claimed in claim 4 , wherein a plurality of solder bumps are formed on an edge of the second surface, wherein the height of the solder bumps exceeds that of the camera module to mechanically and electrically couple to an external circuit thereby.
8. The camera module as claimed in claim 7 , wherein a flange protrudes downwardly from the periphery of the second surface, a plurality of electric patches are respectively positioned on the bottom surface of the flange to mechanically and electrically couple to external circuits via the plurality of solder bumps.
9. The camera module as claimed in claim 4 , wherein the encapsulation glass is an infrared cut filter configured for protecting the photosensitive area of the image sensor chip from staining and discourage light filtering.
10. The camera module as claimed in claim 4 , wherein the sidewall is insulative light-impervious material.
11. A camera module comprising:
an image sensor chip comprising: a photosensitive area, a non-photosensitive area surrounding the photosensitive area, and a plurality of bonding pads formed on the non-photosensitive area;
a sidewall located on the non-photosensitive area and defining a plurality of first through holes aligned with and corresponding to the bonding pads;
an encapsulation glass located on the sidewall;
a plurality of solder balls formed on the encapsulation glass aligned with the bonding pads, respectively, the encapsulation glass defining a plurality of second through holes each corresponding to a bonding pad and a corresponding solder ball, the camera module further comprising a conductive material through which the first and second through holes penetrate;
a lens holder comprising a hollow first portion and a hollow second portion coaxially coupled to the hollow first portion;
a lens received in the hollow first portion of the lens holder;
a circuitized board having a first connecting surface and a second surface facing away from the first connecting surface and defining an opening and formed with a plurality of first base pads on a surface thereof, the lens holder located on the opposite surface of the circuitized board with its optical axis aligned with the opening, and the base pad contacting the solder balls, respectively;
an encapsulation epoxy located on the peripheral of the camera module to firmly fix the camera module to the second surface of the circuitized board.
12. The camera module as claimed in claim 11 , wherein the opening is larger than the photosensitive area.
13. The camera module as claimed in claim 11 , wherein a plurality of second base pads are formed on the first connecting surface, electrically coupling to external circuits.
14. The camera module as claimed in claim 11 , wherein a plurality of solder bumps is formed on the edge of the second surface, the height of the solder bumps exceeding that of the camera module to mechanically and electrically couple to external circuits thereby.
15. The camera module as claimed in claim 14 , wherein a flange protrudes downwardly from the periphery of the second surface, and a plurality of electric patches are respectively positioned on the bottom surface of the flange to mechanically and electrically couple to external circuits via the plurality of solder bumps.
16. The camera module as claimed in claim 11 , wherein the encapsulation glass is an infrared cut filter configured for protecting the photosensitive area of the image sensor chip from being stained and filtering light.
17. The camera module as claimed in claim 1 , wherein the sidewall comprises insulative light-impervious material.