III-nitride device with back-gate and field plate for improving transconductance
View Patent ↗A III-Nitride device has a back-gate disposed in a trench and under and in close proximity to the 2 DEG layer and in lateral alignment with the main gate of the device. A laterally disposed trench is also disposed in a trench and under and in close proximity to the drift region between the gate and drain electrodes of the device. The back-gate is connected to the main gate and the field plate is connected to the source electrode. The back-gate can consist of a highly conductive silicon substrate.
1. A III-Nitride device having improved transconductance, said device comprising:
a substrate;
a first III-nitride layer supported by said substrate;
a second III-Nitride layer atop said first III-Nitride layer and creating a 2 DEG conducting layer at the interface of said first and second III-Nitride layers;
first and second spaced main electrodes connected to said second III-Nitride layer;
a main gate structure connected to said second III-Nitride layer and disposed laterally between said first and second main electrodes and adapted to adjustably change the conductivity of said 2 DEG layer beneath said main gate structure in response to a predetermined signal on said main gate structure; and
a back-gate structure having a lateral position in alignment with a lateral position of said main gate structure and beneath said 2 DEG layer;
said lateral position of said back-gate structure not overlapping with a lateral position of said first main electrode and a lateral position of said second main electrode; and
said back-gate structure electrically connected to a potential of said main gate structure; and
said back-gate structure disposed within a trench without exposing said first III-Nitride layer, wherein a web portion of said substrate is disposed between a bottom surface of said trench and said first III-Nitride layer.
2. The device of claim 1 , which further includes a transition layer disposed between said substrate and said first III-Nitride layer.
3. The device of claim 1 , wherein said first and second III-Nitride layers comprise a GaN layer and an AlGaN layer respectively.
4. The device of claim 2 , wherein said first and second III-Nitride layers comprise a GaN layer and an AlGaN layer respectively.
5. The device of claim 1 , wherein said first and second electrodes comprise source and drain electrodes respectively.
6. The device of claim 4 , wherein said first and second electrodes comprise source and drain electrodes respectively.
7. The device of claim 1 , wherein said main gate stricture comprises a gate dielectric layer on said second III-Nitride layer and a conductive gate layer atop said dielectric layer.
8. The device of claim 6 , wherein said main gate structure comprises a Schottky gate on said second III-Nitride layer.
9. The device of claim 1 , wherein a bottom of said trench is contained within said substrate.
10. The device of claim 1 , wherein a bottom of said trench is contained in said transition layer.
11. The device of claim 9 , wherein said main gate structure comprises a gate dielectric layer on said second III-Nitride layer and a conductive gate layer atop said dielectric layer.
12. The device of claim 10 , wherein said main gate structure comprises a gate dielectric layer on said second III-Nitride layer and a conductive gate layer atop said dielectric layer.
13. The device of claim 1 , which further includes a field plate structure having a lateral position in alignment with a lateral position of at least a portion of the drift region between said main gate structure and said second electrode and beneath said 2 DEG layer; said field plate connected to the potential of said first electrode.
14. The device of claim 5 , which further includes a field plate structure having a lateral position in alignment with a lateral position of at least a portion of the drift region between said main gate structure and said second electrode and beneath said 2 DEG layer; said field plate connected to the potential of said source.
15. The device of claim 7 , which further includes a field plate structure having a lateral position in alignment with a lateral position of at least a portion of the drift region between said main gate structure and said second electrode and beneath said 2 DEG layer; said field plate connected to the potential of said first electrode.
16. The device of claim 13 , wherein said field plate comprises a dielectric layer and a conductive layer atop said field plate dielectric layer.
17. The device of claim 13 , which further includes a second trench in the bottom of said substrate and having a given depth; said field plate structure disposed at the bottom of said second trench.
18. The device of claim 17 , wherein said field plate comprises a dielectric layer and a conductive layer atop said field plate dielectric layer.
19. A III-Nitride device comprising a substrate;
a first III-nitride layer supported by said substrate;
a second III-Nitride layer atop said first III-Nitride layer and creating a 2 DEG conducting layer at the interface of said first and second III-Nitride layers;
first and second spaced main electrodes connected to said second III-Nitride layers;
a main gate structure connected to said second III-Nitride layer and disposed between said first and second main electrodes and adapted to adjustably change the conductivity of said 2 DEG layer beneath said main gate structure in response to a predetermined signal on said main gate structure; and
a field plate structure having a lateral position in alignment with a lateral position of at least a portion of the drift region between said main gate structure and said second electrode and beneath said 2 DEG layer;
said field plate structure not laterally extending beyond said drift region; and
said field plate structure electrically connected to a potential of said first main electrode.
20. The device of claim 19 , which further includes a transition layer disposed between said substrate and said first III-Nitride layer.
21. The device of claim 19 , wherein said first and second III-Nitride layers comprise a GaN layer and an AlGaN layer respectively.
22. The device of claim 19 , wherein said field plate comprises a dielectric layer beneath said 2 DEG layer and a conductive layer underneath said dielectric layer.
23. The device of claim 19 , which further includes a trench in the bottom of said substrate and having a given depth; said field plate structure disposed at the bottom of said trench.
24. The device of claim 23 , wherein said trench bottom is disposed within said substrate.
25. The device of claim 23 , wherein the bottom of said trench is disposed in said transition layer.