Lighting module

1. A lighting module comprising:

a base panel; and

a plurality of light-emitting diode chips attached directly to the base panel in electrical communication with a conductive trace;

wherein at least a portion of the base panel has a lumens-density metric greater than 1.0×10 6 lm 2 /mm 2 W.

2. The lighting module of claim 1 , wherein the plurality of light-emitting diode chips include chips having a width of less than about 600 microns and a length of less than about 600 microns.

3. The lighting module of claim 1 , wherein the plurality of light-emitting diode chips include chips having a width of less than about 300 microns and a length of less than about 475 microns.

4. The lighting module of claim 1 , further comprising:

a power source coupled to the conductive trace.

5. The lighting module of claim 1 , further comprising a plurality of cups, wherein each cup encircles a chip.

6. The lighting module of claim 1 , wherein a at least one chip includes phosphor-doped coating.

7. The lighting module of claim 1 , further comprising phosphor-doped dome disposed over at least one chip.

8. The lighting module of claim 1 , wherein the lumens-density metric is greater than 2.0×10 6 lm 2 /mm 2 W.

9. The lighting module of claim 1 , wherein the lumens-density metric is about 2.9×10 6 lm 2 /mm 2 W.

10. The lighting module of claim 4 , wherein at least one of the plurality of light-emitting diode chips has a rated current, and wherein the power source is adapted to deliver a drive current of less than about 75% of the rated current.

11. The lighting module of claim 4 , wherein at least one of the plurality of light-emitting diode chips has a rated current, and wherein the power source is adapted to deliver a drive current of less than about 50% of the rated current.

12. The lighting module of claim 4 , wherein the plurality of light-emitting diode chips include chips having a width of about 260 microns, a length of about 450 microns, and a rated current of about 20 milli-amperes.

13. The lighting module of claim 12 , wherein the power source is adapted to deliver a drive current equal to or less than about 14 milli-amperes.

14. The lighting module of claim 5 , wherein at least one cup has a reflective coating.

15. The lighting module of claim 5 , wherein at least one cup includes a ventilation opening.

16. The lighting module of claim 5 , wherein at least one cup has a phosphor-doped mixture disposed therein.

17. The lighting module of claim 5 , further comprising a phosphor-doped disk disposed within at least one cup.

18. The lighting module of claim 17 , wherein the phosphor-doped disk is at least partially formed of silicone.

19. The lighting module of claim 17 , wherein the phosphor-doped disk is formed of LSR-70.

20. A lighting module comprising:

a base panel; and

wherein an area of the base panel about four inches wide and about four inches long includes about twenty-five light-emitting diode chips attached directly to the base panel in electrical communication with a conductive trace, wherein each light-emitting diode chip is about 500 μm wide by about 500 μm long; and

a power source delivering a forward voltage of about 3.2+/−0.3 volts;

wherein at least a portion of the base panel has a lumens-density metric greater than 2.0×10 6 lm 2 /mm 2 W.

21. A lighting module comprising:

a base panel; and

wherein an area of the base panel about four inches wide and about four inches long includes about twenty-five light-emitting diode chips attached directly to the base panel in electrical communication with a conductive trace, wherein each light-emitting diode chip is about 500 μm wide by about 500 μm long; and

a power source delivering a rated current of about 0.080+/−0.010 amperes;

wherein at least a portion of the base panel has a lumens-density metric greater than 2.0×10 6 lm 2 /mm 2 W.

22. A method of preparing a lighting module, comprising:

attaching a plurality of light-emitting diode chips to a base panel in accordance with a lumens-density metric of greater than 1.0×10 6 lm 2 /mm 2 W; and

coupling the light-emitting diode chips to a conductive trace.

23. The method of claim 22 , wherein the lumens-density metric is greater than 2.0×10 6 lm 2 /mm 2 W.

24. The method of claim 22 , wherein the lumens-density metric is about 2.9×10 6 lm 2 /mm 2 W.

25. The method of claim 22 , further comprising:

coupling the conductive trace to a power source; and

adapting the power source to deliver a de-rated current to the plurality of light-emitting diode chips.

26. A lighting module comprising:

a base panel;

a plurality of conductive traces disposed on the base panel; and

a plurality of light-emitting diode chips in electrical communication with the conductive traces and arranged in a serial configuration;

wherein at least a portion of the base panel has a lumens-density metric greater than 1.0×10 6 lm 2 /mm 2 W.

27. The lighting module of claim 26 , further comprising:

a power source coupled to at least one of the conductive traces.

28. The lighting module of claim 27 , wherein the plurality of light-emitting diode chips include chips having a width of about 500 μm and a length of about 500 μm.

29. The lighting module of claim 28 , wherein the power source delivers about 50 mA of current to plurality of light-emitting diode chips.

30. A lighting module comprising:

a base panel; and

an 18 mm by 18 mm section of the base panel including four light-emitting diode chips, wherein each light-emitting diode chip is about 500 μm wide and about 500 μm long and is in electrical communication a conductive trace in a serial configuration; and

a current source delivering about 50 mA of current to the light-emitting diode chips;

wherein at least a portion of the base panel has a lumens-density metric greater than 1.0×10 6 lm 2 /mm 2 W.