IP Library Granted Patent US 8,861,766
Granted Patent B2
US 8,861,766 · App. 12/217,469 · Granted Oct 14, 2014

Headphones

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Quick Facts
Patent No.
US 8,861,766
App. No.
12/217,469
Granted
Oct 14, 2014
Kind
B2
Abstract

A headphone set has at least one speaker section. The speaker section includes a baffle having at least one sound emitting hole, a surrounding wall formed on the baffle so that the surrounding wall protrudes from the baffle and surrounds the sound emitting hole, a speaker unit installed within the surrounding wall and having a first surface to face the sound emitting hole and an opposite second surface, a unit case provided as touching the surrounding wall and covering the second surface of the speaker unit, a first cavity existing as enclosed by the unit case and the second surface of the speaker unit, and a housing provided as touching the baffle and covering the unit case, a second cavity existing as enclosed by the housing, the unit case, and the baffle.

Claims (22)

1. A headphone set comprising at least one speaker section, the speaker section including:

a baffle having a front surface and a rear surface, and at least one sound emitting hole penetrating through the front and rear surfaces;

a surrounding wall formed on the rear surface of the baffle so that the surrounding wall protrudes from the rear surface of the baffle in a direction opposite to the front surface of the baffle and surrounds the sound emitting hole on the rear surface of the baffle;

a speaker unit installed on the rear surface of the baffle so that the speaker unit is tightly surrounded by the surrounding wall on the rear surface of the baffle and having a front sound-emitting surface that faces the sound emitting hole and having a rear surface;

a unit case that touches a protruding end of the surrounding wall, the rear surface of the speaker unit being covered by the unit case and surrounded by the surrounding wall on the rear surface of the baffle such that a first cavity is enclosed by the unit case, the surrounding wall and the rear surface of the speaker unit;

a housing that touches the rear surface of the baffle to cover the unit case such that a second cavity is enclosed by the housing, the unit case, the surrounding wall, and the baffle, the second cavity being positioned so as to cover the first cavity between the housing and the baffle, with the unit case being positioned between the first and second cavities; and

a microphone having a front sound-receiving surface and a rear surface, the rear surface of the microphone and the front sound-emitting surface of the speaker unit facing each other within the surrounding wall.

2. The headphone set according to claim 1 , wherein the speaker section includes:

a circuit board that functions with a power supplied by a battery; and

a container for containing the battery, the container being formed on the baffle.

3. The headphone set according to claim 2 , wherein the container is provided so that a part of the battery protrudes from the baffle in a direction opposite of the surrounding wall that protrudes from the baffle, when the battery is contained in the container.

4. The headphone set according to claim 3 further comprising an ear pad having a pad and a pad holder to hold the pad, the ear pad being attached to the baffle so that the pad holder almost touches the part of the battery that protrudes from the baffle, when the battery is contained in the container.

5. The headphone set according to claim 1 further comprising a further speaker section, the further speaker section including:

a baffle having a front surface and a rear surface, and at least one sound emitting hole penetrating through the front and rear surfaces;

a surrounding wall formed on the rear surface of the baffle so that the surrounding wall protrudes from the rear surface of the baffle in a direction opposite to the front surface of the baffle and that surrounds the sound emitting hole on the rear surface of the baffle;

a speaker unit installed on the rear surface of the baffle so that the speaker unit is tightly surrounded by the surrounding wall on the rear surface of the baffle, the speaker unit having a front sound-emitting surface that faces the sound emitting hole and having a rear surface;

a unit case that touches a protruding end of the surrounding wall, the rear surface of the speaker unit being covered by the unit case and surrounded by the surrounding wall on the rear surface of the baffle, such that a first cavity is enclosed by the unit case, the surrounding wall and the rear surface of the speaker unit;

a housing that touches the rear surface of the baffle to cover the unit case such that a second cavity is enclosed by the housing, the unit case, the surrounding wall, and the baffle, the second cavity being positioned so as to cover the first cavity between the housing and the baffle, with the unit case being positioned between the first and second cavities; and

a microphone having a front sound-receiving surface and a rear surface, the rear surface of the microphone and the front sound-emitting surface of the speaker unit facing each other within the surrounding wall, wherein:

at least either of the speaker section and the further speaker section includes a circuit board that functions with a power supplied by a battery, and

the speaker section and the further speaker section include a first concave section and a second concave section, respectively, each concave section being formed on the front surface of the baffle, each concave section being not communicated with the first and second cavities and being curved down in a direction in which the surrounding wall protrudes from the baffle, a shape and size of the first and second cavities being identical between the speaker section and the further speaker section, and a shape and size of the first and second concave sections being identical to each other.

6. The headphone set according to claim 5 , wherein the first concave section contains the battery whereas the second concave section has means to avoid installation of the battery therein.

Assignments (2)
MERGER Recorded Apr 6, 2012
From: VICTOR COMPANY OF JAPAN, LTD.
To: JVC KENWOOD CORPORATION
Reel/Frame 028001/0342 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 3, 2008
From: OURYOUJI, MAKOTO
To: VICTOR COMPANY OF JAPAN, LTD.
Reel/Frame 021242/0379 →