Method for manufacturing a miniature surface-mount electronic component
View Patent ↗A miniature surface-mount electronic component which can ensure sufficient impact resistance and vibration resistance especially in an application to a severe use environment such as a vehicle-mounted coil, by putting some contrivance into a method for fixing a coil in a molding process and a method for holding a core and terminals. A miniature surface-mount electronic component including a bar-shaped core 2 on which a winding wire 3 is wound, and metal plates 5 , with an outer casing 7 made of an insulating resin molded, includes flanges 2 b substantially quadrangular in section at both ends of the bar-shaped core 2 , and vertical grooves a and b are provided on side surfaces of the flanges 2 b of the bar-shaped core 2 as fixing portions for preventing positional displacement occurring when the outer casing 7 is molded.
1. A method for manufacturing a miniature surface-mount electronic component comprising a bar-shaped core on which a winding wire is wound, metal plate terminals to which said winding wire is connected, and an outer casing of insulating resin formed by a mold, comprising the steps of:
preparing the bar-shaped core having rectangular flanges at both ends, and having vertical grooves on opposite side surfaces of said flanges;
fixing said metal plate terminals to a base having a pair of pillars made of insulating resin;
fitting the pair of pillars in said vertical grooves; and
contacting protrusions of said mold to said vertical grooves of said bar-shaped core, said protrusions being provided for preventing displacement caused by molding said outer casing.
2. The method of claim 1 , said metal plate terminals being made of a metal plate that is bent in a U-shape in longitudinal direction, said metal plate having protrusions on both sides at the end and one of said protrusions being connected with said winding wire.