Semiconductor device having double side electrode structure and method of producing the same
View Patent ↗A semiconductor device includes a package substrate having a front surface and a backside surface; an electrode pad formed on the front surface; an outer connection pad formed on the backside surface and electrically connected to the electrode pad; a semiconductor chip mounted on the front surface and having an electrode electrically connected to the electrode pad; a sealing resin layer having a through hole formed with a die-molding and reaching the electrode pad for sealing the semiconductor chip; and a through electrode filled in the through hole with a conductive material and having one end portion electrically connected to the electrode pad and the other end portion exposed from the sealing resin layer.
1. A method of producing a semiconductor device, comprising the steps of:
preparing a substrate frame to be divided into a package substrate;
forming an electrode pad on a front surface of the package substrate;
forming an outer connection pad on a backside surface of the package substrate so that the outer connection pad is electrically connected to the electrode pad;
mounting a semiconductor chip on the front surface so that an electrode of the semiconductor chip is electrically connected to the electrode pad;
molding a sealing resin layer using a die metal having a plurality of protrusions with a. column shape and contacting with the electrode pad so that the die metal is pressed against a surface of the substrate frame so that the sealing resin layer includes a plurality of through holes each exposing the electrode pad and seals the semiconductor chip, said through holes being arranged in a pattern along an outer contour of the semiconductor chip;
filling each of the through holes with a conductive material to form a through electrode having one end portion electrically connected to the electrode pad and the other end portion exposed from the sealing resin layer, said through electrodes being situated surrounding the semiconductor chip; and
scribing the substrate frame to divide the substrate frame into the package substrate.
2. The method according to claim 1 , wherein, in the step of molding the sealing resin layer with the die metal, the sealing resin layer is molded with the die metal having a plurality of protrusions arranged to surround the semiconductor chip.
3. The method according to claim 1 , wherein, in the step of molding the sealing resin layer with the die metal, the sealing resin layer is molded with the die metal having the protrusion integrated with the die metal.
4. The method according to claim 1 , wherein, in the step of molding the sealing resin layer with the die metal, the sealing resin layer is molded with the die metal having the protrusion formed of a pin inserted into the die metal.
5. A method of producing a semiconductor device, comprising the steps of:
preparing a substrate frame to be divided into a package substrate;
forming an electrode pad on a front surface of the package substrate;
forming an outer connection pad on a backside surface of the package substrate so that the outer connection pad is electrically connected to the electrode pad;
mounting a semiconductor chip on the front surface so that an electrode of the semiconductor chip is electrically connected to the electrode pad;
molding a sealing resin layer using a die metal having a plurality of protrusions with a column shape and contacting with the electrode pad so that the die metal is pressed against a surface of the substrate frame so that the sealing resin layer includes a plurality of through holes each exposing the electrode pad and seals the semiconductor chip, said through holes being arranged in a pattern along an outer contour of the semiconductor chip;
filling each of the through holes with a conductive material to form a through electrode having one end portion electrically connected to the electrode pad and the other end portion exposed from the sealing resin layer, said through electrodes being situated surrounding the semiconductor chip;
forming a re-distribution pad on a surface of the sealing resin layer;
forming a connection wiring portion on the surface of the sealing resin layer for electrically connecting the other end of the through electrode and the re-distribution pad; and
scribing the substrate frame to divide the substrate frame into the package substrate.
6. The method according to claim 5 , wherein, in the step of molding the sealing resin layer with the die metal, the sealing resin layer is molded with the die metal having a plurality of protrusions arranged to surround the semiconductor chip.
7. The method according to claim 5 , wherein, in the step of molding the sealing resin layer with the die metal, the sealing resin layer is molded with the die metal having the protrusion integrated with the die metal.
8. The method according to claim 5 , wherein, in the step of molding the sealing resin layer with the die metal, the sealing resin layer is molded with the die metal having the protrusion formed of a pin inserted into the die metal.