Power module and method of fabricating the same

1. A power module comprising:

a molded power package comprising at least one power device on a first lead frame; and

a molded control package vertically stacked on the power package, and comprising at least one control device on a second lead frame,

wherein a first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package are electrically coupled to each other,

wherein the power package further comprises one or more first wiring pads on the first part of the first lead frame, and the control package further comprises one or more second wiring pads on the first part of the second lead frame,

wherein the power module further comprising solder, and wherein the one or more first wiring pads and the one or more second wiring pads are bonded to each other with the solder.

2. The power module of claim 1 , wherein the power package further comprises a first molding member covering the power device such that the first part of the first lead frame is exposed out of the first molding member.

3. The power module of claim 2 , wherein the first lead frame comprises a first surface and a second surface, the power device is disposed on the first surface, and a part of the second surface is exposed out of the first molding member to bond to the first part of the second lead frame.

4. The power module of claim 3 , wherein an end portion of the first lead frame is bent in a direction from the first surface to the second surface.

5. The power module of claim 2 , wherein the power package further comprises a heat dissipation substrate that is disposed on a surface of the power device opposite to that disposed on the first lead frame such that a part of the heat dissipation substrate is exposed out of the first molding member.

6. The power module of claim 1 , wherein the control package further comprises a second molding member covering the control device such that the first part of the second lead frame is exposed out of the second, molding member.

7. The power module of claim 6 , wherein the second lead frame comprises a third surface and a fourth surface, the control device is disposed on the third surface, and a part of the fourth surface is exposed out of the second molding member to bond to the first part of the first lead frame.

8. The power module of claim 7 , wherein an end portion of the second lead frame is bent in a direction from the fourth surface to the third surface.

9. The power module of claim 1 , wherein the power package further comprises one or more conductive bumps between the power device and the first lead frame.

10. A power module comprising:

a first lead frame having a first surface and a second surface;

at least one power device disposed on the first surface of the first lead frame;

a first molding member covering the at least one power device, and exposing a first part of the second surface of the first lead frame;

a second lead frame having a third surface and a fourth surface, wherein a first part of the fourth surface is bonded with the exposed first part of the second surface of the first lead frame;

at least one control device disposed on the third surface of the second lead frame; and

a second molding member covering the at least one control device, and exposing the first part of the fourth surface of the second lead frame.

11. The power module of claim 10 , wherein the exposed first part of the second surface of the first lead frame and the exposed first part of the fourth surface of the second lead frame are bonded to each other using soldering.

12. The power module of claim 10 , further comprising:

a heat dissipation substrate disposed on a surface of the at least one power device on opposite to that disposed on the first lead frame, wherein a part of the heat dissipation substrate is exposed out of the first molding member.

13. The power module of claim 12 , wherein an end portion of the first lead frame and an end portion of the second lead frame are bent in a direction opposite to that in which the heat dissipation substrate is disposed with respect to the first lead frame.

14. The power module of claim 10 , wherein the power package comprises a flip-chip package structure.

15. A method of fabricating a power module, the method comprising:

forming a molded power package comprising at least one power device on a first lead frame;

forming a molded control package comprising at least one control device on a second lead frame; and

bonding a first part of the first lead frame with a first part of the second lead frame so that the power package and the control package can be electrically coupled to each other,

wherein the bonding of the first part of the first lead frame with the first page of the second lead frame is performed using a soldering process.

16. The method of claim 15 , wherein the soldering process comprises:

injecting solder between the first part of the first lead frame and the first part of the second lead frame; and

reflowing the solder.

17. The method of claim 15 , wherein the forming of the power package comprises:

forming one or more conductive bumps on the power device;

disposing the first lead frame on the conductive bumps;

reflowing the one or more conductive bumps; and

forming a first molding member covering the power device, whereby the first part of the first lead frame is exposed.

18. The method of claim 17 , wherein the forming of the power package further comprises:

stacking the power device on a heat dissipation substrate before forming the one or more conductive bumps.

19. The method of claim 15 , wherein the forming of the control package comprises:

mounting the at least one control device on the second lead frame;

electrically coupling the second lead frame to the control device; and

forming a second molding member covering the control device, whereby the first part of the second lead frame is exposed.

20. The method of claim 19 , wherein the electrical coupling between the second lead frame and the control device is performed using a wire bonding or a bump connection.

21. The method of claim 15 , further comprising:

trimming and bending end portions of the first lead frame and the second lead frame after performing the bonding process.