IP Library Patent Application 12222516
Patent Application
App. No. 12/222,516

Printed circuit board with multi layer ceramic capacitor and flat panel display device using the same

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Quick Facts
Patent No.
US None
App. No.
12/222,516
Abstract

A printed circuit board has an opening, and a multi-layer ceramic capacitor is disposed inside the opening and is coupled to the printed circuit board. The multi layer ceramic capacitor is coupled to the printed circuit board in a manner that a center of gravity of the multi-layer ceramic capacitor is at substantially the same level as a center of gravity of the printed circuit board.

Claims (11)

1 . A printed circuit board module comprising:

a printed circuit board having an opening; and

a multi-layer ceramic capacitor disposed inside the opening and coupled to the printed circuit board.

2 . The printed circuit board as claimed in claim 1 , wherein the multi layer ceramic capacitor is coupled to the printed circuit board in a manner that a center of gravity of the multi-layer ceramic capacitor is at substantially the same level as a center of gravity of the printed circuit board.

3 . The printed circuit board as claimed in claim 1 , wherein the multi-layer ceramic capacitor is fixedly coupled to the printed circuit board with a coupling material that connects the multi-layer ceramic capacitor to an edge of the opening.

4 . A flat panel display device including:

a display panel for displaying an image;

a printed circuit board for driving the display panel, the printed circuit board having an opening; and

a multi-layer ceramic capacitor disposed inside the opening and coupled to the printed circuit board.

5 . The flat panel display device as claimed in claim 4 , wherein the multi layer ceramic capacitor is coupled to the printed circuit board in a manner that a center of gravity of the multi-layer ceramic capacitor is at substantially the same level as a center of gravity of the printed circuit board.

6 . The printed circuit board as claimed in claim 4 , wherein the multi-layer ceramic capacity or is fixedly coupled to the printed circuit board with a coupling material that connects the multi-layer ceramic capacitor to an edge of the opening.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2008
From: SAMSUNG SDI CO., LTD.
To: SAMSUNG MOBILE DISPLAY CO., LTD.
Reel/Frame 022034/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2008
From: KIM, SANG-UK; KIM, SHAWN; HWANG, SEONG-WOOCK; CHO, IN-YOUNG; PARK, JEONG-MIN
To: SAMSUNG SDI CO., LTD., A CORPORATION OF THE REPUBLIC OF KOREA
Reel/Frame 021520/0109 →