Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
View Patent ↗A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
1. A composition prepared by mixing components comprising:
(I) an alkenyl functional, phenyl-containing polyorganosiloxane having an average compositional formula given as R 1 a R 2 b SiO (4-a-b)/2 where R 1 is an alkenyl group having 2 to 12 carbon atoms, each R 2 is independently a methyl group or a phenyl group, at least 30 mol % of R 2 are phenyl groups, a and b are positive numbers having values such that: a+b=1 to 2.2 and a/(a+b)=0.001 to 0.05;
(II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having a molecular formula given as HR 3 2 SiO(SiPh 2 O) x SiR 3 2 H where Ph represents a phenyl group, each R 3 is independently a methyl group or a phenyl group, x is an integer from 2 to 8, and x has an average value of 2 to 4; and
(III) a hydrosilylation catalyst.
2. The composition of claim 1 , where component (I) is selected from:
ViMe 2 SiO(SiMePhO) n SiMe 2 Vi,
ViMe 2 SiO(SiPh 2 O) n SiMe 2 Vi,
ViMe 2 SiO(SiMe 2 O) n (SiMePhO) m SiMe 2 Vi,
ViMe 2 SiO(SiMe 2 O) n (SiPh 2 O) m SiMe 2 Vi,
HexMe 2 SiO(SiMePhO) n SiMe 2 Hex,
HexMe 2 SiO(SiPh 2 O) n SiMe 2 Hex,
HexMe 2 SiO(SiMe 2 O) n (SiMePhO) m SiMe 2 Hex,
HexMe 2 SiO(SiMe 2 O) n (SiPh 2 O) m SiMe 2 Hex,
ViMePhSiO(SiMePhO) n SiMePhVi,
ViMePhSiO(SiPh 2 O) n SiMePhVi,
ViMePhSiO(SiMe 2 O) n (SiMePhO) m SiMePhVi,
ViMePhSiO(SiMe 2 O) n (SiPh 2 O) m SiMePhVi,
ViMe 2 SiO(SiMePhO) n (SiMeViO) m SiMe 2 Vi,
ViMe 2 SiO(SiMe 2 O) n (SiMePhO) m (SiMeViO) 1 SiMe 2 Vi,
ViMe 2 SiO(SiMe 2 O) n (SiPh 2 O) m (SiMeViO) 1 SiMe 2 Vi,
ViMePhSiO(SiMePhO) n (SiMeViO) m SiMePhVi,
ViMePhSiO(SiMe 2 O) n (SiMePhO) m (SiMeViO) 1 SiMePhVi,
ViMePhSiO(SiMe 2 O) n (SiPh 2 O) m (SiMeViO) 1 SiMePhVi,
Me 3 SiO(SiMePhO) n (SiMeViO) m SiMe 3 ,
Me 3 SiO(SiMe 2 O) n (SiMePhO) m (SiMeViO) 1 SiMe 3 ,
Me 3 SiO(SiMe 2 O) n (SiPh 2 O) m (SiMeViO) 1 SiMe 3 ,
Me 3 SiO(SiMePhO) n (SiMeHexO) m SiMe 3 ,
Me 3 SiO(SiMe 2 O) n (SiMePhO) m (SiMeHexO) 1 SiMe 3 ,
Me 3 SiO(SiMe 2 O) n (SiPh 2 O) m (SiMeHexO) 1 SiMe 3 ,
(ViMe 2 SiO 1/2 ) p (PhSiO 3/2 ) q ,
(ViMe 2 SiO 1/2 ) p (Me 2 SiO 2/2 ) q (PhSiO 3/2 ) r ,
(ViMe 2 SiO 1/2 ) p (MePhSiO 2/2 ) q (PhSiO 3/2 ) r ,
(ViMe 2 SiO 1/2 ) p (Ph 2 SiO 2/2 ) q (PhSiO 3/2 ) r ,
(ViMe 2 SiO 1/2 ) p (MeSiO 32 ) q (PhSiO 3/2 ) r ,
(ViMe 2 SiO 1/2 ) p (PhSiO 3/2 ) q (SiO 4/2 ) r ,
(HexMePhSiO 1/2 ) p (PhSiO 3/2 ) q ,
(ViMePhSiO 1/2 ) p (PhSiO 3/2 ) q ,
(ViMePhSiO 1/2 ) p (Me 2 SiO 2/2 ) q (PhSiO 3/2 ) r ,
(ViMePhSiO 1/2 ) p (MePhSiO 2/2 ) q (PhSiO 3/2 ) r ,
(ViMePhSiO 1/2 ) p (Ph 2 SiO 2/2 ) q (PhSiO 3/2 ) r ,
(ViMePhSiO 1/2 ) p (MeSiO 3/2 ) q (PhSiO 3/2 ) r ,
(ViMePhSiO 1/2 ) p (PhSiO 3/2 ) q (SiO 4/2 ) r ,
(ViMePhSiO 1/2 ) p (PhSiO 3/2 ) q ,
(HexMe 2 SiO 1/2 ) p (PhSiO 3/2 ) q ,
(HexMe 2 SiO 1/2 ) p (Me 2 SiO 2/2 ) q (PhSiO 3/2 ) r ,
(HexMe 2 SiO 1/2 ) p (MePhSiO 2/2 ) q (PhSiO 3/2 ) r ,
(HexMe 2 SiO 1/2 ) p (Ph 2 SiO 2/2 ) q (PhSiO 3/2 ) r ,
(HexMe 2 SiO 1/2 ) p (MeSiO 3/2 ) q (PhSiO 3/2 ) r ,
(Me 3 SiO 1/2 ) p (MeViSiO 2/2 ) q (PhSiO 3/2 ) r ,
(Me 3 SiO 1/2 ) p (ViSiO 3/2 ) q (PhSiO 3/2 ) r ,
(Me 3 SiO 1/2 ) p (MeViSiO 2/2 ) q (PhSiO 3/2 ) r ,
(ViMeSiO 2/2 ) p (Me 2 SiO 2/2 ) q (PhSiO 3/2 ) r ,
(ViMeSiO 2/2 ) p (MePhSiO 2/2 ) q (PhSiO 3/2 ) r ,
(ViMeSiO 2/2 ) p (Ph 2 SiO 2/2 ) q (PhSiO 3/2 ) r ,
(ViMeSiO 2/2 ) p (MeSiO 3/2 ) q (PhSiO 3/2 ) r ,
(ViMeSiO 2/2 ) p (PhSiO 3/2 ) q (SiO 4/2 ) r ,
(ViMeSiO 2/2 ) p (Me 2 SiO 2/2 ) q (PhSiO 3/2 ) r ,
(ViMeSiO 2/2 ) p (MePhSiO 2/2 ) q (PhSiO 3/2 ) r ,
(HexMeSiO 2/2 ) p (Ph 2 SiO 2/2 ) q (PhSiO 3/2 ) r ,
(HexMeSiO 2/2 ) p (MeSiO 3/2 ) q (PhSiO 3/2 ) r ,
(HexMeSiO 2/2 ) p (PhSiO 3/2 ) q (SiO 4/2 ) r , or
a combination thereof,
where n, m, l are positive numbers less than 200 that mean the average number of each monomer unit; and p, q, r, and s mean the average mol percentages of each monomer unit.
3. The composition of claim 2 , further comprising a component selected from: (IV) a co-crosslinker (V) an adhesion promoter, (VI) a filler, (VII) treating agent, (VIII) an optically active agent, (IX) a cure modifier, (X) a rheology modifier, or a combination thereof.
4. A silicone product prepared by curing the composition of claim 2 .
5. The composition of claim 1 , where the composition contains 0.1% to 35% branched alkenyl functional, phenyl-containing polyorganosiloxane based on the weight of the composition.
6. The composition of claim 5 , further comprising a component selected from: (IV) a co-crosslinker (V) an adhesion promoter, (VI) a filler, (VII) treating agent, (VIII) an optically active agent, (IX) a cure modifier, (X) a rheology modifier, or a combination thereof.
7. A silicone product prepared by curing the composition of claim 5 .
8. The composition of claim 1 , where component (II) is selected from:
HMe 2 SiO(SiPh 2 O) x SiMe 2 H,
HMePhSiO(SiPh 2 O) x SiMePhH, or
a combination thereof.
9. The composition of claim 8 , further comprising a component selected from: (IV) a co-crosslinker (V) an adhesion promoter, (VI) a filler, (VII) treating agent, (VIII) an optically active agent, (IX) a cure modifier, (X) a rheology modifier, or a combination thereof.
10. A silicone product prepared by curing the composition of claim 8 .
11. The composition of claim 1 , further comprising a component selected from: (IV) a co-crosslinker (V) an adhesion promoter, (VI) a filler, (VII) treating agent, (VIII) an optically active agent, (IX) a cure modifier, (X) a rheology modifier, or a combination thereof.
12. A silicone product prepared by curing the composition claim 1 .
13. A device comprising:
i) a semiconductor chip,
ii) a lead frame;
iii) a wire bonding the semiconductor chip to the lead frame, and
iv) the silicone product of claim 12 coated over the semiconductor chip.
14. The device of claim 13 , where the semiconductor chip is light emitting.
15. A composition prepared by mixing components comprising:
(I) an Si—H functional, phenyl-containing polyorganosiloxane having an average compositional formula given as H a R 2 b SiO (4-a-b)/2 where each R 2 is independently a methyl group or a phenyl group, at least 30 mol % of R 2 are phenyl groups, a and b are positive numbers having values such that: a+b=1 to 2.2 and a/(a+b)=0.001 to 0.05;
(II) an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having a molecular formula given as R 1 R 3 2 SiO(SiPh 2 O) x SiR 3 2 R where Ph represents a phenyl group, each R 1 is independently an alkenyl group having 2 to 12 carbon atoms, each R 3 is independently a methyl group or a phenyl group, x is an integer from 2 to 8, and x has an average value of 2 to 4; and
(III) a hydrosilylation catalyst.
16. A multiple part composition having Part A and Part B, where
Part A comprises:
(I) an alkenyl functional, phenyl-containing polyorganosiloxane having an average compositional formula given as R 1 a R 2 b SiO (4-a-b)/2 where R 1 is an alkenyl group having 2 to 12 carbon atoms, each R 2 is independently a methyl group or a phenyl group, at least 30 mol % of R 2 are phenyl groups, a and b are positive numbers having values such that: a+b=1 to 2.2 and a/(a+b)=0.001 to 0.05;
(III) a hydrosilylation catalyst,
optionally (V) an adhesion promoter
optionally (VI) a filler,
optionally (VII) a treating agent,
optionally (VIII) a cure modifier, and
(IX) a rheology modifier;
Part B comprises
optionally (I) the alkenyl functional phenyl-containing polyorganosiloxane,
(II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having a molecular formula given as HR 3 2 SiO(SiPh 2 O) x SiR 3 2 H where Ph represents a phenyl group, each R 3 is independently a methyl group or a phenyl group, x is an integer from 2 to 8, and x has an average value of 2 to 4;
optionally (IV) a co-crosslinker;
optionally (V) an adhesion promoter;
optionally (VI) a filler;
optionally (VII) a treating agent;
optionally (VIII) a cure modifier; and
optionally (IX) a rheology modifier.
17. The kit of claim 16 , further comprising instructions for mixing Part A and Part B together in a weight ratio of Part A:Part B of 0.05:1 to 20:1.
18. A multiple part composition having Part A and Part B, where
Part A comprises:
(II) an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having a molecular formula given as R 1 R 3 2 SiO(SiPh 2 O) x SiR 3 2 R 1 where Ph represents a phenyl group, each R 1 is independently an alkenyl group having 2 to 12 carbon atoms, each R 3 is independently a methyl group or a phenyl group, x is an integer from 2 to 8, and x has an average value of 2 to 4,
(III) a hydrosilylation catalyst,
optionally (V) an adhesion promoter
optionally (VI) a filler,
optionally (VII) a treating agent,
optionally (VIII) a cure modifier, and
(IX) a rheology modifier;
Part B comprises
(I) an Si—H functional, phenyl-containing polyorganosiloxane having an average compositional formula given as H a R 2 b SiO (4-a-b)/2 where each R 2 is independently a methyl group or a phenyl group, at least 30 mol % of R 2 are phenyl groups, a and b are positive numbers having values such that: a+b=1 to 2.2 and a/(a+b)=0.001 to 0.05;
optionally (II) an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having a molecular formula given as R 1 R 3 2 SiO(SiPh 2 O) x SiR 3 2 R 1 where Ph represents a phenyl group, each R 1 is independently an alkenyl group having 2 to 12 carbon atoms, each R 3 is independently a methyl group or a phenyl group, x is an integer from 2 to 8, and x has an average value of 2 to 4,
optionally (IV) a co-crosslinker;
optionally (V) an adhesion promoter;
optionally (VI) a filler;
optionally (VII) a treating agent;
optionally (VIII) a cure modifier; and
optionally (IX) a rheology modifier.
19. The kit of claim 18 , further comprising instructions for mixing Part A and Part B together in a weight ratio of Part A:Part B of 0.05:1 to 20:1.