Method for producing a hole
View Patent ↗There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.
1. A method for producing a hole in a layer system, comprising:
providing a layer system having a metallic substrate and an outermost ceramic layer, providing a pulsed energy beam with a shorter pulse length and a longer pulse length; and
using different pulse lengths in different ablation steps, wherein the longer pulse length of the different pulse lengths has a pulse lengths of >0.4 ms.
2. The method as claimed in claim 1 , wherein the energy beam is a laser beam, wherein the laser beam is displaced over the surface of the component during the ablation steps with shorter pulse lengths, in order to ablate material in the region of a plane of the hole to be produced.
3. The method as claimed in claim 1 ,
wherein longer pulse lengths greater than 400 ns are used during first ablation steps in order to ablate a metallic interlayer or the metallic substrate;
and wherein shorter pulse lengths of less than or equal to 400 ns are used in one of last ablation steps.
4. The method as claimed in claim 1 , wherein shorter longer pulse lengths are used during first ablation steps than in one of last ablation steps.
5. The method as claimed in claim 1 , wherein the longer pulse length is used in order to ablate a metallic interlayer or the metallic substrate.
6. The method as claimed in claim 1 , wherein the pulse length is varied continuously or discontinuously in the course of producing the hole.
7. The method as claimed in claim 1 , wherein only two different pulse lengths are used.
8. The method as claimed in claim 1 , wherein the at least one energy beam is displaced over the surface of the component in the case of the longer pulse durations.
9. The method as claimed in claim 1 , wherein only one laser with a wavelength of 1064 nm or 532 nm is used.
10. The method as claimed in claim 1 , wherein a plurality of lasers are used to produce the hole.
11. The method as claimed in claim 10 , wherein different wavelengths of 1064 nm and 532 nm are used for the lasers.
12. The method as claimed in claim 10 , wherein at least two lasers are used simultaneously.
13. The method as claimed in claim 1 , wherein shorter pulse lengths of less than or equal to 500 ns are used during last ablation steps or during the first ablation steps.
14. The method as claimed in claim 1 , wherein an outer upper region of the hole is initially produced with shorter pulse lengths and then a lower region of the hole is produced with longer pulse lengths.
15. The method as claimed in claim 1 , wherein an outer edge region is initially produced with shorter pulse lengths and then an inner region of the hole is produced with longer pulse lengths.
16. The method as claimed in claim 1 , wherein an inner region is initially produced with longer pulse lengths, and then an outer edge region of the hole is produced with shorter pulse lengths.
17. The method as claimed in claim 1 , wherein a pulse duration of from >0.4 ms to 1.2 ms is used for the longer pulses.
18. The method as claimed in claim 1 , wherein the longer pulses have an energy of from 6 to 21 joules.
19. The method as claimed in claim 1 , wherein the longer pulses have a power of from 10 to 50 kW.
20. The method as claimed in claim 1 , wherein the energy of the shorter pulses lies in or below a two-figure millijoule range.
21. The method as claimed in claim 1 , wherein the longer pulses generate the cross-sectional area of the region to be ablated on the component corresponding to the cross-sectional area of the hole to be produced.
22. The method as claimed in claim 1 , wherein an output power of the laser of less than 300 watts is used for the shorter pulses.
23. The method as claimed in claim 1 , wherein the layer system consists of a substrate and a metallic layer, wherein the layer system has a composition of a MCrAlX type, wherein M stands for at least one element of the group consisting of iron, cobalt or nickel, and wherein X stands for yttrium and/or at least one rare earth element.
24. The method as claimed in claim 23 , wherein the substrate is a nickel-, cobalt- or iron-based superalloy.
25. The method as claimed in claim 1 , wherein a component which is a turbine blade, a heat shield element or another component or housing part of a gas turbine or steam turbine, is processed by the method.
26. The method as claimed in claim 1 , wherein the method is used for a new production of a component.
27. The method as claimed in claim 1 , wherein the method is used for a component to be refurbished.