IP Library Patent Application 12230741
Patent Application
App. No. 12/230,741

Mounting method, electric part-mounted substrate and an electric device

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Quick Facts
Patent No.
US None
App. No.
12/230,741
Abstract

An electric device having high reliability is to be produced. An adhesive layer includes a thermosetting resin and a radiation-curable resin, and a portion of the adhesive layer is protruded outwardly from an edge of the electric part. Radiation rays do not pass through the electric part, and the radiation-curable resin is cured in the protruding portion, while the radiation-curable resin in that portion of the adhesive layer which is positioned right behind the electric part is not polymerized. Since the electric part is fixed with the polymerized radiation-curable type resin, the electric part is not misaligned when the electric part is pressed under heating.

Claims (20)

1 . An electric part-mounting method comprising:

providing an adhesive layer containing a thermosetting resin and a radiation-curable resin, a substrate, and an electric part,

arranging the adhesive layer, the substrate and the electric part in such a manner that the adhesive layer is positioned between the substrate and the electric part and a portion of the adhesive layer protrudes outwardly from an edge of the electric part,

irradiating radiation rays upon the protruding portion of the adhesive layer,

thereafter applying a pressing force between the electric part and the substrate, while the adhesive layer is heated, and mechanically connecting the electric part to the substrate.

2 . The mounting method according to claim 1 ,

wherein the radiation rays comprise radiation rays having such a wavelength that does not allow them to pass through the electric part are used,

the radiation rays are irradiated from a face of the substrate on which the electric part is disposed, and

the radiation rays are irradiated to the electric part as well as to the protruding portion.

3 . The mounting method according to claim 1 ,

wherein the adhesive layer is provided with a planar shape that is greater than that of the electric part being used, and

the edge of the electric part is surrounded by the protruding portion, when the adhesive layer is positioned between the substrate and the electric part.

4 . An electric part-mounted substrate having an electric part that is temporarily fixed with a layer of an adhesive,

wherein the adhesive layer contains a radiation-curable resin and a thermosetting resin,

a portion of the adhesive layer is positioned between a substrate and the electric part, and other portion of the adhesive layer protrudes outwardly from an edge of the electric part, and

the other portion of the adhesive layer protruding outwardly from the edge of the electric part having a photopolymer in which the radiation-curable resin is polymerized by irradiation with radiation rays.

5 . An electric device having an electric part fixed to a substrate with a layer of an adhesive,

wherein the adhesive layer contains a radiation-curable resin and a thermosetting resin, a portion of the adhesive layer is positioned between the electric part and the substrate, and other portion of the adhesive layer protrudes outwardly from an edge of the electric part,

the other portion of the adhesive layer protruding outwardly from the edge of the electric part having a photopolymer in which the radiation-curable resin is polymerized by irradiation with radiation rays, and

the portion of the adhesive layer between the electric part and the substrate having a thermally polymerized material in which the thermosetting resin is cured by heating.

Assignments (2)
CHANGE OF NAME Recorded Dec 3, 2012
From: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
To: DEXERIALS CORPORATION
Reel/Frame 029434/0208 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2008
From: FURUTA, KAZUTAKA; KANISAWA, SHIYUKI; TANIGUCHI, MASAKI
To: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
Reel/Frame 021660/0781 →