IP Library Granted Patent US 8,217,361
Granted Patent B2
US 8,217,361 · App. 12/230,976 · Granted Jul 10, 2012

Ultraviolet sensor

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,217,361
App. No.
12/230,976
Granted
Jul 10, 2012
Kind
B2
Abstract

An ultraviolet sensor has an ultraviolet detection diode having a depletion region 18 formed in an Si layer 16 on an insulating layer 14 , an interlayer insulating film 20 formed on the ultraviolet detection diode, and a wiring 24 formed on the interlayer insulating film 20 . An incident angle θ (°) of an incident light entering into the depletion region 18 and a film thickness T si (nm) of the depletion region 18 satisfy the following formula (1), which is also shown in FIG. 14. T Si ≦T Si /sin θ≦100  (Formula 1)

Claims (26)

1. An ultraviolet sensor comprising:

an ultraviolet detection diode having a depletion region formed in an Si layer on an insulating layer;

an interlayer insulating film formed on the ultraviolet detection diode; and

a wiring formed on the interlayer insulating film,

wherein an incident angle θ(°) of incident light entering into the depletion region and a film thickness T si (nm) of the depletion region satisfy the following formula (1):

T Si ≦T Si /sin θ≦100

2. The ultraviolet sensor according to claim 1 , wherein

the depletion region and the wiring are alternatively arranged, and

a distance between an end part of the upper surface on the wiring side in the depletion region and an intersection point between a line, which is drawn from the side surface on the depletion region side in the wiring so as to be vertical with respect to the Si layer direction, and the surface of the Si layer is not less than 0.1 and not more than 3.92 μm.

3. The ultraviolet sensor according to claim 1 , wherein

an antireflection film is formed on a side wall of the wiring.

4. The ultraviolet sensor according to claim 1 , wherein

a plurality of the wirings are stacked.

5. An ultraviolet sensor comprising:

an ultraviolet detection diode having a depletion region formed in an Si layer on an insulating layer;

an interlayer insulating film formed on the ultraviolet detection diode; and

a wiring formed on the interlayer insulating film,

wherein the wiring and a film thickness T si (nm) of the depletion region are configured such that, for all available values of an incident angle θ (°) of incident light entering into the depletion region, the incident angle and the film thickness satisfy the following formula (1):

T Si ≦T Si /sin θ≦100

6. The ultraviolet sensor according to claim 5 , wherein

the depletion region and the wiring are alternatively arranged, and

a distance between an end part of the upper surface on the wiring side in the depletion region and an intersection point between a line, which is drawn from the side surface on the depletion region side in the wiring so as to be vertical with respect to the Si layer direction, and the surface of the Si layer is not less than 0.1 μm and not more than 3.92 μm.

7. The ultraviolet sensor according to claim 5 , wherein

an antireflection film is formed on a side wall of the wiring.

8. The ultraviolet sensor according to claim 5 , wherein

a plurality of the wirings are stacked.

Assignments (3)
CHANGE OF NAME Recorded Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
CHANGE OF NAME Recorded Jan 29, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022231/0935 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2008
From: OKIHARA, MASAO
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 021568/0532 →