Semiconductor device
View Patent ↗A semiconductor device according to the present invention includes a base tape (film carrier tape); a semiconductor chip mounted on the base tape; conducting leads formed on the base tape to be connected to the semiconductor chip; input terminals and output terminals connected to the conducting leads; and a protecting layer formed to cover the conducting leads completely. The base tape is provided at its side edges with roller-contact regions, where carrier rollers are to be in contact with. No holes and no unevenness area is formed on the roller-contact regions.
1. A semiconductor device, comprising:
a base tape (film carrier tape);
a semiconductor chip mounted on the base tape;
conducting leads formed on the base tape to be connected to the semiconductor chip;
input terminals and output terminals connected to the conducting leads; and
a protecting layer formed to cover the conducting leads completely,
wherein the base tape is provided at its side edges with roller-contact regions, where carrier rollers are to be in contact with, and
no holes and no unevenness area is formed on the roller-contact regions.
2. A semiconductor device, according to claim 1 , wherein
the roller-contact regions of the base tape is completely covered with the protecting layer.
3. A semiconductor device, according to claim 1 , wherein
the roller-contact regions of the base tape is not covered with the protecting layer.
4. A semiconductor device, according to claim 1 , wherein
the semiconductor device is of a COF (Chip On Film) type.
5. A semiconductor device, according to claim 1 , wherein
the semiconductor device is of a TCP (Tape Carrier Package) type.