Maunfacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server
View Patent ↗There is disclosed a manufacturing method for exposure mask, which comprises acquiring a first information showing surface shape of surface of each of a plurality of mask substrates, and a second information showing the flatness of the surface of each of mask substrates before and after chucked on a mask stage of an exposure apparatus, forming a corresponding relation of each mask substrate, the first information and the second information, selecting the second information showing a desired flatness among the second information of the corresponding relation, and preparing another mask substrate having the same surface shape as the surface shape indicated by the first information in the corresponding relation with the selected second information, and forming a desired pattern on the above-mentioned another mask substrate.
1. A method of manufacturing a mask substrate, comprising:
acquiring a surface shape of a main surface of a mask substrate to have a desired flatness of the main surface of the mask substrate after the mask substrate on which a mask pattern is not yet formed is chucked on a mask stage of an exposure apparatus; and
preparing a mask substrate which has a same surface shape as the acquired surface shape.
2. The method of manufacturing a mask substrate according to claim 1 , wherein acquiring the surface shape of the main surface of the mask substrate comprises acquiring the surface shape from a correspondence relation between the acquired surface shape of the mask substrate and the flatness of the main surface of the mask substrate after the mask substrate is chucked on the mask stage of the exposure apparatus.
3. The method of manufacturing a mask substrate according to claim 1 , wherein acquiring the surface shape of the main surface of the mask substrate comprises acquiring a surface shape of the main surface of the mask substrate to have a desired flatness of the main surface of the mask substrate before and after the mask substrate on which a mask pattern is not yet formed is chucked on the mask stage of the exposure apparatus.
4. The method of manufacturing a mask substrate according to claim 1 , wherein the acquired surface shape of the mask substrate is convex in a region except a peripheral region of the mask substrate.
5. The method of manufacturing a mask substrate according to claim 2 , wherein the acquired surface shape of the mask substrate is convex in a region except a peripheral region of the mask substrate.
6. The method of manufacturing a mask substrate according to claim 3 , wherein the acquired surface shape of the mask substrate is convex in a region except a peripheral region of the mask substrate.
7. The method of manufacturing a mask substrate according to claim 4 , wherein the region except the peripheral region of the mask substrate is 142 mm square.
8. The method of manufacturing a mask substrate according to claim 4 , wherein the acquired surface shape of the mask substrate is convex in a region where the mask substrate is chucked by the exposure apparatus.
9. The method of manufacturing a mask substrate according to claim 5 , wherein the acquired surface shape of the mask substrate is convex in a region where the mask substrate is chucked by the exposure apparatus.
10. The method of manufacturing a mask substrate according to claim 6 , wherein the acquired surface shape of the mask substrate is convex in a region where the mask substrate is chucked by the exposure apparatus.
11. The method of manufacturing a mask substrate according to claim 7 , wherein the acquired surface shape of the mask substrate is convex in a region where the mask substrate is chucked by the exposure apparatus.
12. The method of manufacturing a mask substrate according to claim 8 , wherein the acquired surface shape of the mask substrate is concave in a region except a peripheral region of the mask substrate, and convex in a region where the mask substrate is chucked by the exposure apparatus.
13. The method of manufacturing a mask substrate according to claim 9 , wherein the acquired surface shape of the mask substrate is concave in a region except a peripheral region of the mask substrate, and convex in a region where the mask substrate is chucked by the exposure apparatus.
14. The method of manufacturing a mask substrate according to claim 10 , wherein the acquired surface shape of the mask substrate is concave in a region except a peripheral region of the mask substrate, and convex in a region where the mask substrate is chucked by the exposure apparatus.
15. The method of manufacturing a mask substrate according to claim 11 , wherein the acquired surface shape of the mask substrate is concave in a region except a peripheral region of the mask substrate, and convex in a region where the mask substrate is chucked by the exposure apparatus.