Method of making a scratch-and etch-resistant coated glass article
View Patent ↗A method of making a scratch resistant coated article which is also resistant to attacks by at least some fluorine-inclusive etchant(s) for at least a period of time is provided. In certain example embodiments, an anti-etch layer(s) is provided on a glass substrate in order to protect the glass substrate from attacks by fluorine-inclusive etchant(s), a scratch resistant layer of or including DLC is provided over the anti-layer(s), and a seed layer is provided between the anti-layer(s) and the scratch resistant layer so as to facilitate the adhesion of the scratch resistant layer while also helping to protect the anti-layer(s). Optionally, a base layer(s) or underlayer(s) may be provided under at least the anti-etch layer(s).
1. A method of making a coated article, the method comprising:
providing a glass substrate;
forming an anti-etch layer on the glass substrate, the anti-etch layer consisting essentially of fluorine-doped tin oxide;
ion beam depositing a scratch-resistant layer comprising diamond-like carbon (DLC) on the glass substrate over the anti-etch layer; and
forming a seed layer between the anti-etch layer and the layer comprising DLC, the seed layer facilitating adhesion of the layer comprising DLC and/or protecting the anti-etch layer from damage during the ion beam depositing of the layer comprising DLC.
2. The method of claim 1 , wherein the seed layer comprises silicon nitride.
3. The method of claim 1 , wherein the anti-etch layer is deposited via flame pyrolysis, combustion vapor deposition, flame deposition, or spray pyrolysis.
4. The method of claim 1 , further comprising forming a base layer or underlayer on the glass substrate,
wherein the anti-etch layer is deposited over the base layer or underlayer.
5. The method of claim 4 , wherein the base layer or underlayer is a low-E color suppression layer stack.
6. The method of claim 5 , wherein the low-E color suppression layer stack comprises a layer of tin oxide on the glass substrate and a layer of silicon oxide provided on the tin oxide opposite the glass substrate.
7. The method of claim 1 , wherein the coated article is a window.
8. The method of claim 1 , wherein the coated article has a visible transmission of at least about 50%.
9. The method of claim 1 , wherein the anti-etch layer is resistant to fluorine-inclusive etchants.
10. The method of claim 1 , further comprising forming a base layer or underlayer on the glass substrate,
wherein the anti-etch layer is deposited over the base layer or underlayer, and
wherein the seed layer comprises silicon nitride.
11. The method of claim 1 , wherein the anti-etch layer is about 150-350 nm thick,
wherein the seed layer is about 1-5 nm thick, and
wherein the layer comprising DLC is about 3-5 nm thick.
12. A method of making a coated article, the method comprising:
providing a glass substrate;
forming a base layer or underlayer on the glass substrate;
forming an anti-etch layer over the base layer or underlayer, the anti-etch layer comprising at least one of fluorine-doped tin oxide and cerium oxide;
ion beam depositing a layer comprising diamond-like carbon (DLC) on the glass substrate over the anti-etch layer; and
forming a seed layer between and contacting both the anti-etch layer and the layer comprising DLC, the seed layer comprising silicon nitride.
13. The method of claim 12 , further comprising facilitating, via the seed layer, the ion beam depositing of the layer comprising DLC.
14. The method of claim 12 , wherein the seed layer helps protect the anti-etch layer from damage during the ion beam depositing of the layer comprising DLC.
15. The method of claim 12 , wherein the base layer or underlayer is a low-E layer stack.
16. The method of claim 15 , wherein the low-E layer stack comprises a layer of tin oxide on the glass substrate and a layer of silicon oxide provided on the tin oxide opposite the glass substrate.
17. The method of claim 12 , wherein the coated article has a visible transmission of at least about 50%.
18. The method of claim 12 , wherein the anti-etch layer is resistant to fluorine-inclusive etchants.
19. The method of claim 12 , wherein the anti-etch layer consists essentially of fluorine-doped tin oxide.