IP Library Granted Patent US 7,751,255
Granted Patent B2
US 7,751,255 · App. 12/233,670 · Granted Jul 6, 2010

Semiconductor nonvolatile memory device

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Quick Facts
Patent No.
US 7,751,255
App. No.
12/233,670
Granted
Jul 6, 2010
Kind
B2
Abstract

An operation scheme for operating stably a semiconductor nonvolatile memory device is provided. When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes. Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

Claims (20)

1. An integrated semiconductor nonvolatile memory, comprising:

a first insulated-gate field effect transistor with a first gate having a gate electrode formed in a stacked fashion on a semiconductor substrate via an insulating film;

a second insulated-gate field effect transistor with a second gate including a charge storage film formed in a region on said semiconductor substrate adjacent to said first insulated-gate field effect transistor;

a first channel formed in said semiconductor substrate, below said first insulated-gate field effect transistor;

a second channel formed in said semiconductor substrate, below said second insulated-gate field effect transistor and adjacent to said first channel so as to be electrically connected thereto; and

a first diffusion-layer electrode and second diffusion-layer electrode formed at one end of said first channel and an opposite end of said second channel, respectively, so as to sandwich a region on said semiconductor substrate where said first channel and said second channel are formed;

wherein programming is executed by applying a voltage to said second gate and injecting electrons and a hole from a region of said second channel into said charge storage film; and

wherein the programming is executed by conducting multi-step voltage application to said second gate, and each of voltages applied in a multi-step manner is determined in accordance with a predetermined reference table.

2. The integrated semiconductor nonvolatile memory according to claim 1 , wherein the reference table is stored in accordance with circuit element composition.

3. The integrated semiconductor nonvolatile memory according to claim 1 , wherein the multi-step voltage application is followed by verification.

4. An integrated semiconductor nonvolatile memory, comprising:

a first insulated-gate field effect transistor with a first gate having a gate electrode formed in a stacked fashion on a semiconductor substrate via an insulating film;

a second insulated-gate field effect transistor with a second gate including a charge storage film formed in a region on said semiconductor substrate adjacent to said first insulated-gate field effect transistor;

a first channel formed in said semiconductor substrate, below said first insulated-gate field effect transistor;

a second channel formed in said semiconductor substrate, below said second insulated-gate field effect transistor and adjacent to said first channel so as to be electrically connected thereto; and

a first diffusion-layer electrode and second diffusion-layer electrode formed at one end of said first channel and an opposite end of said second channel, respectively, so as to sandwich a region on said semiconductor substrate where said first channel and said second first channel are formed;

wherein programming and erasure are executed by applying voltage to said second gate and injecting electrons and a hole from a region of said second channel into said charge storage film; and

wherein the programming and erasure are executed by conducting multi-step voltage application to said second gate a plurality of times, and each of multi-step voltages applied is determined in accordance with a predetermined reference table.

5. The integrated semiconductor nonvolatile memory according to claim 4 , wherein the reference table is stored in accordance with circuit element composition.

6. The integrated semiconductor nonvolatile memory according to claim 4 , wherein the multi-step voltage application is followed by verification.

Assignments (3)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Sep 9, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024973/0099 →
MERGER Recorded Sep 9, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024982/0040 →