LED interconnect assembly

1. A light-emitting device assembly, the assembly comprising:

a contact carrier having a light-emitting device receiving region and resilient contacts provided proximate to the light-emitting device receiving region;

a light-emitting device, the light-emitting device having leads which extend therefrom, the leads mechanically and electrically engaging the resilient contacts;

a heat sink thermally coupled to the light-emitting device, the heat sink drawing heat away from the light-emitting device to maintain the light-emitting device at a proper operating temperature;

a cover extending over the contact carrier and the light-emitting device, the cover having an opening which aligns with the light-emitting device, the opening having a sidewall, at least one portion of the sidewall having resiliency; and

a securing member integral with the cover, the securing member extending through the contact carrier and into the heat sink to releasably retain the contact carrier and the light-emitting device in position relative to each other and relative to the heat sink;

whereby as the cover is latched to the heat sink, the at least one portion of the sidewall resiliently cooperates with the light-emitting device to maintain the light-emitting device in position.

2. An assembly as recited in claim 1 wherein the contact carrier is a substrate which is positioned between the light-emitting device and the heat sink, the substrate having a heat sink receiving opening through which a portion of the heat sink extends to thermally engage the light-emitting device.

3. An assembly as recited in claim 2 wherein a thermally conductive material is provided between the portion of the heat sink which extends into the heat sink receiving opening and the light-emitting device, the thermally conductive material facilitating the heat being drawn away from the light-emitting device.

4. An assembly as recited in claim 2 wherein and the securing member being a plurality of latching legs which cooperate with openings in the heat sink to resiliently latch to the cover to the heat sink, causing the light-emitting device and the resilient contacts to be maintained in electrical engagement and the light-emitting device and the heat sink to be maintained in thermal engagement.

5. An assembly as recited in claim 4 wherein the opening of the cover having slits provided in the sidewalls thereof; the slits separate the at least one portions of the sidewalls whereby.

6. An assembly as recited in claim 1 wherein the contact carrier is a molded interconnect device.

7. An assembly as recited in claim 6 wherein a mating connector receiving recess is integrally molded in the contact carrier, the mating connector receiving recess being configured to receive a mating connector therein.

8. An assembly as recited in claim 1 wherein the light-emitting device is a light-emitting diode.

9. A light-emitting diode assembly, the assembly comprising:

a contact carrier having a light-emitting diode receiving region and resilient contacts provided proximate to the light-emitting diode receiving region, the light-emitting diode receiving region having a heat sink engagement area;

a light-emitting diode, the light-emitting diode having leads which extend therefrom, the leads mechanically and electrically engaging the resilient contacts;

a heat sink extending into the heat sink engagement area and thermally coupled to the light-emitting diode, the heat sink drawing heat away from the light-emitting diode to maintain the light-emitting diode at a proper operating temperature;

a cover extending over the contact carrier and the light-emitting diode, the cover having an opening which aligns with the light-emitting diode, the opening having a sidewall, the sidewall having at least one section having resiliency; and

a securing member, the securing member extending through the contact carrier and into the heat sink to releasably retain the contact carrier and the light-emitting diode in position relative to each other and relative to the heat sink;

whereby as the cover is latched to the heat sink, the at least one section of the sidewall resiliently cooperates with the light-emitting diode to maintain the light-emitting diode in position.

10. An assembly as recited in claim 9 wherein the contact carrier is a substrate which is positioned between the light-emitting diode and the heat sink.

11. An assembly as recited in claim 10 wherein a thermally conductive material is provided between the portion of the heat sink which extends in the heat sink receiving opening and the light-emitting diode, the thermally conductive material facilitating the heat being drawn away from the light-emitting diode.

12. An assembly as recited in claim 10 wherein the securing member being a plurality of latching legs which cooperate with openings in the heat sink to resiliently latch to the cover to the heat sink, causing the light-emitting diode and the resilient contacts to be maintained in electrical engagement and the light-emitting diode and the heat sink to be maintained in thermal engagement.

13. An assembly as recited in claim 12 wherein the opening of the cover having slits provided in the sidewalls thereof; the slits separate the at least one section of the sidewall.

14. An assembly as recited in claim 9 wherein the contact carrier is the cover having mounting openings through which the securing member extends.

15. A light-emitting diode assembly, the assembly comprising:

a molded interconnect device having a light-emitting diode receiving region and resilient contacts provided proximate to the light-emitting diode receiving region, the light-emitting diode receiving region having a heat sink engagement area;

a light-emitting diode, the light-emitting diode having leads which extend therefrom, the leads mechanically and electrically engaging the resilient contacts;

a heat sink extending into the heat sink engagement area and thermally coupled to the light-emitting diode;

a cover extending over the molded interconnect device and the light-emitting diode, the cover having an opening which aligns with the light-emitting diode, the opening having a resilient sidewall; and

a securing member, the securing member extending through the molded interconnect device and into the heat sink to releasably retain the molded interconnect device and the light-emitting diode in position relative to each other and relative to the heat sink;

whereby as the cover is latched to the heat sink, the sidewall resiliently cooperates with the light-emitting diode to maintain the light-emitting diode in position.

16. An assembly as recited in claim 15 wherein the molded interconnect device is a substrate which is positioned between the light-emitting diode and the heat sink.

17. An assembly as recited in claim 16 wherein the securing member being a plurality of latching legs which cooperate with openings in the heat sink to resiliently latch to the cover to the heat sink, causing the light-emitting diode and the resilient contacts to be maintained in electrical engagement and the light-emitting diode and the heat sink to be maintained in thermal engagement.

18. An assembly as recited in claim 17 wherein the opening of the cover having slits provided in the sidewalls thereof; the slits separate portions of the sidewall, allowing the portions of the sidewalls to have independent resiliency, whereby as the cover is latched to the heat sink, the portions of the sidewalls resiliently cooperate with the light-emitting diode to maintain the light-emitting device diode in position.

19. An assembly as recited in claim 15 wherein the cover having mounting openings through which the securing members extend.