Printed circuit board preform with test facilitating means
An exemplary printed circuit board preform ( 20 ) includes at least two printed circuit board units ( 211 ), at least one boundary ( 201, 202 ) formed on the junction of the at least two printed circuit board units, and at least one conductor ( 206, 208 ) configured on a surface of the printed circuit board preform and crossing the at least one boundary of the at least two printed circuit board units.
1. A printed circuit board preform comprising:
at least two printed circuit board units;
at least one boundary formed at a junction of the at least two printed circuit board units;
at least one conductor configured on a surface of the printed circuit board preform and crossing the at least one boundary of the at least two printed circuit board units, wherein the at least one conductor is substantially U-shaped and crosses over the at least one boundary into the adjacent printed circuit board unit correspondingly; and
at least one pair of contacts formed on ends of the at least one conductor correspondingly, wherein the at least one conductor is configured in a manner such that the ends thereof are on one side of the at least one boundary, and a U-bend portion of the at least one conductor is on the other side of the at least one boundary.
2. The printed circuit board preform as claimed in claim 1 , wherein the at least one pair of contacts is located on the same side of and adjacent to the at least one boundary.
3. The printed circuit board preform as claimed in claim 1 , wherein the at least one conductor is metallic wires.
4. The printed circuit board preform as claimed in claim 3 , wherein the at least one conductor is copper wires.
5. The printed circuit board preform as claimed in claim 4 , wherein the diameter of a cross-section of the at least one conductor is 0.1 mm to 0.15 mm.
6. The printed circuit board preform as claimed in claim 3 , wherein the at least one conductor is formed on the surface of the printed circuit board preform via printing, and the outer surface of the at least one conductor is processed by solder resisting.
7. The printed circuit board preform as claimed in claim 1 , wherein the at least one pair of contacts is formed on the surface of the printed circuit board preform via metal deposition.
8. The printed circuit board preform as claimed in claim 7 , wherein the at least one pair of contacts is formed on the surface of the printed circuit board preform via tin deposition or copper deposition.
9. The printed circuit board preform as claimed in claim 7 , wherein the outer surfaces of the at least one pair of contacts are processed by solder resisting.
10. The printed circuit board preform as claimed in claim 9 , wherein each of the at least one pair of contacts is substantially circular with an initial diameter of each about 0.8 mm, and after solder resisting, the diameter of each of the at least one pair of contacts is about 0.9 mm.
11. The printed circuit board preform as claimed in claim 1 , wherein the distance between the centers of the at least one pair of contacts is about 2.3 mm to 2.8 mm; the displacement between a center of each of the at least one pair of contacts and the at least one boundary is about 0.9 mm; and the maximum displacement by which the at least one conductor crosses the at least one boundary is about 0.3 mm.