RFID device having protective cap element and method of making
The present invention relates to a dynamic RFID device assembly which is able to withstand the additional stresses of using RFID devices in a non-planar arrangement. The invention includes the provision of a protective cap to prevent the fracturing or breakage of chip and antenna connection. The RFID device of the present invention can be included in a housing which may also be flexible thereby adding additional stability to the device.
1. An RFID device, comprising;
a substrate having first and second surfaces;
an intermediate structure, the intermediate structure including a chip and conductive leads;
an antenna applied to the first surface of the substrate and the chip connected to the antenna via the conductive leads on the first surface of the substrate;
a flexible protective cap applied substantially over the chip and only a portion of the antenna, the protective cap extending generally upwardly from the first surface of the substrate;
and wherein the RFID device is used in a non-planar arrangement, and the substrate is a flexible polyethylene-based film or paper.
2. An RFID device as recited in claim 1 , wherein the chip is connected to the antenna by conductive leads.
3. An RFID device as recited in claim 2 , wherein the protective cap substantially covers the conductive leads.
4. An RFID device as recited in claim 1 , wherein the protective cap is made of a flexible material.
5. An RFID device as recited in claim 4 , wherein the protective material is selected from a group including polyurethane, polyethylene, and other plastic and rubber like materials.
6. An RFID device as recited in claim 1 , wherein the portion of the antenna covered by the protective cap includes connection points between the chip and the antenna.
7. An RFID device as recited in claim 1 , wherein the protective cap is permanently bonded to the chip.
8. An RFID device, comprising;
a flexible housing, the flexible housing having an exterior portion and an interior portion, with the interior portion having a cavity having a first dimension;
an RFID inlay disposed within the cavity and having a second dimension less than the first dimension, the RFID inlay including a substrate having first and second surfaces, an antenna provided on the first surface and a chip connected to the antenna on the first surface, and a flexible protective covering provided substantially over the chip and only a portion of the antenna, the flexible protective covering extending generally upward from the first surface of the substrate;
the cavity having a space not occupied by the RFID inlay;
and wherein the RFID device is used in a non-planar arrangement.
9. An RFID device as recited in claim 8 , wherein the portion of the antenna covered by the protective covering includes a connection area between the chip and the antenna.
10. An RFID device as recited in claim 8 , wherein the chip is connected to the antenna by conductive leads.
11. An RFID device as recited in claim 10 , wherein the protective covering covers over the conductive leads.
12. An RFID device as recited in claim 8 , wherein the protective covering is permanently bonded to the RFID inlay.
13. An RFID device as recited in claim 8 , wherein protective covering is provided over less than a majority of the first surface of the substrate.
14. A method of making an RFID device, comprising the steps of;
providing an RFID inlay, the RFID inlay including a substrate having first and second surfaces with an antenna applied to the first surface;
providing an intermediate structure, the intermediate structure including a chip and conductive leads;
attaching the conductive leads to the antenna;
covering the chip and a portion of the antenna with a flexible protective cover, the flexible protective cover extending generally upward from the first surface of the substrate;
and subjecting the RFID device to additional stresses in a non-planar arrangement.
15. A method as recited in claim 14 , including a further step of preparing a housing having an exterior portion and an interior with the interior portion defining a cavity prior to the step of providing an RFID inlay.
16. A method as recited in claim 15 , including a further step of positioning the RFID inlay within the cavity of the housing after the step of preparing a housing.
17. A method as recited in claim 16 , including a further step of sealing the RFID inlay in the cavity in the housing after the step of covering the chip.
18. A method as recited in claim 16 , including a further step of attaching the RFID inlay to the housing after the step of positioning.
19. A method as recited in claim 18 , wherein the RFID inlay is attached along an end edge of the housing.
20. An RFID device as recited in claim 8 , wherein the cavity includes an inert gas.
21. An RFID device as recited in claim 8 , wherein the cavity is filled with a gel or liquid.
22. An RFID device as recited in claim 8 , wherein the RFID inlay is free floating within the cavity.
23. An RFID device as recited in claim 8 , wherein the RFID inlay is attached to an interior end edge of the housing.