IP Library Granted Patent US 9,074,825
Granted Patent B2
US 9,074,825 · App. 12/239,186 · Granted Jul 7, 2015

Heatsink apparatus and electronic device having the same

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Quick Facts
Patent No.
US 9,074,825
App. No.
12/239,186
Granted
Jul 7, 2015
Kind
B2
Abstract

A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus is provided on an external wall with a heat-generating body. The heatsink apparatus includes a box-shaped heat-receiving unit transferring heat to a heat-receiving plate; an inlet pipe supplying the working fluid to the heat-receiving unit; an outlet pipe discharging vapors into which the working fluid supplied to the heat-receiving plate is evaporated by heat; and a heat dissipater provided at a location higher than the heat-receiving unit and dissipating heat of the vapor passing through the outlet pipe. Slits are provided to the heat-receiving plate on a surface surrounded by an external circumference of the inlet pipe toward outside of the heat-receiving plate.

Claims (38)

1. A heatsink apparatus performing cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase, the heatsink apparatus comprising:

a heat receiver transferring heat to an internal wall configured to correspond to a surface of an external wall that is provided with a heat generating body;

an inlet pipe supplying the working fluid into an interior space of the heat receiver, wherein the inlet pipe extends inwardly beyond an internal surface of the heat receiver that partially defines the interior space;

an outlet pipe discharging vapor, generated by vaporizing, by heat from the internal wall, the working fluid supplied into the heat receiver;

a heat dissipater provided at a location higher than the heat receiver and dissipating heat of the vapor passing through the outlet pipe to liquefy the vapor into the working fluid; and

a check valve provided to the inlet pipe causing the working fluid that is liquefied by the heat dissipater to return to the heat receiver through the check valve, and the check valve causing the working fluid to circulate in a direction without using a pump based on a pressure increase that occurs on an outlet side of the check valve; wherein

slits are provided in the internal wall, on a surface surrounded by an external circumference of an opening of the inlet pipe, and wherein

the slits are provided radially in a direction from a central axis of the inlet pipe opening.

2. The heatsink apparatus according to claim 1 , wherein the external circumference of the inlet pipe opening is provided symmetrically with respect to the internal wall and configured such that a center of a heat source of the heat generating body is positionable within the external circumference of the inlet pipe opening with respect to a plan view.

3. The heatsink apparatus according to claim 1 , wherein the inlet pipe opening contacts the internal wall.

4. The heatsink apparatus according to claim 1 , wherein the slits are provided at a central portion of the internal wall surrounded by the external circumference of the inlet pipe opening.

5. The heatsink apparatus according to claim 1 , wherein a width of the slits is wider at a location farther from the center of the inlet pipe opening.

6. The heatsink apparatus according to claim 1 , wherein a ratio of thickness h with respect to thickness H (h/H) is from 0.1 to 0.3, the thickness h being a thickness from a bottom portion of the slits to the surface of the external wall, the thickness H being a thickness from the internal wall provided with no slits to the surface of the external wall.

7. The heatsink apparatus according to claim 1 , wherein a gap between the inlet pipe opening and the internal wall is 0.2 mm or less.

8. The heatsink apparatus according to claim 1 , wherein a groove is provided intersecting the slits and the inlet pipe opening is inserted into the groove.

9. The heatsink apparatus according to claim 1 , wherein the check valve regulates the working fluid to flow in one direction from the heat dissipater to the heat receiver.

10. The heatsink apparatus according to claim 9 , wherein the check valve is provided on an opening side of the inlet pipe.

11. A heatsink apparatus performing cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase, the heatsink apparatus comprising:

a heat receiver transferring heat to an internal wall configured to correspond to a surface of an external wall that is provided with the heat generating body;

an inlet pipe supplying the working fluid to an interior space of the heat receiver, wherein the inlet pipe extends inwardly beyond an internal surface of the heat receiver that partially defines the interior space;

an outlet pipe discharging vapor, generated by vaporizing, by heat from the internal wall, the supplied working fluid in the heat receiver;

a heat dissipater provided at a location higher than the heat receiver and dissipating heat of the vapor passing through the outlet pipe to liquefy the vapor into the working fluid; and

a check valve provided to the inlet pipe causing the working fluid that is liquefied by the heat dissipater to return to the heat receiver through the check valve, and the check valve causing the working fluid to circulate in a direction without using a pump based on a pressure increase that occurs on an outlet side of the check valve; wherein

a thickness of the internal wall is thinner than a thickness of a surrounding internal wall, the internal wall being provided inside an external circumference of an opening of the outlet pipe and configured to correspond to a portion of the external wall on which the heat-generating body is provided, and wherein

slits are provided in the internal wall on a surface surrounded by an external circumference of an opening of the inlet pipe, and wherein

the slits are provided radially in a direction from a central axis of the inlet pipe opening.

12. An electronic device including the heat generating body and comprising the heatsink apparatus according to claim 1 .

13. An electronic device including the heat generating body and comprising the heatsink apparatus according to claim 2 .

14. An electronic device including the heat generating body and comprising the heatsink apparatus according to claim 3 .

15. An electronic device including the heat generating body and comprising the heatsink apparatus according to claim 11 .

16. A heatsink apparatus performing cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase, the heatsink apparatus comprising:

a heat receiver transferring heat to an internal wall configured to correspond to a surface of an external wall that is provided with a heat generating body;

an inlet pipe supplying the working fluid into an interior space of the heat receiver, wherein the inlet pipe extends inwardly beyond an internal surface of the heat receiver that partially defines the interior space;

an outlet pipe discharging vapor, generated by vaporizing, by heat from the internal wall, the working fluid supplied into the heat receiver;

a heat dissipater provided at a location higher than the heat receiver and dissipating heat of the vapor passing through the outlet pipe to liquefy the vapor into the working fluid; and

a check valve provided to the inlet pipe causing the working fluid that is liquefied by the heat dissipater to return to the heat receiver through the check valve, and the check valve causing the working fluid to circulate in a direction without using a pump based on a pressure increase that occurs on an outlet side of the check valve, and wherein

slits are provided in the internal wall on a surface surrounded by an external circumference of an opening of the inlet pipe, and wherein

the slits are provided radially in a direction from a central axis of the inlet pipe opening.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERRONEOUSLY FILED APPLICATION NUMBERS 13/384239, 13/498734, 14/116681 AND 14/301144 PREVIOUSLY RECORDED ON REEL 034194 FRAME 0143. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →