Circuit device
View Patent ↗Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.
1. A circuit device, comprising:
a case member;
a first circuit board and a second circuit board fitted into the case member and arranged in such a way that the first circuit board is overlaid by the second circuit board, the first circuit board having a first inner surface and a first outer surface opposite from the first inner surface, the second circuit board having a second inner surface and a second outer surface opposite from the second inner surface, and the first inner surface facing the second inner surface to define a cavity in the case member;
a first circuit element secured to the first inner surface of the first circuit board;
a second circuit element secured to the second outer surface of the second circuit board, the second circuit element having an operation temperature lower than the first circuit element and controlling an operation of the first circuit element;
a first sealing resin covering the first circuit element on the first inner surface of the first circuit board; and
a second sealing resin covering the second inner surface of the second circuit board, wherein
the first and second sealing resins occupy the cavity so as to leave a hollow portion between the first and second circuit boards.
2. The circuit device of claim 1 , further comprising a third circuit element secured to the second inner surface of the second circuit board so as to be covered by the second sealing resin, and a third sealing resin covering the second circuit element on the second outer surface of the second circuit board.
3. The circuit device of claim 1 , further comprising a lead, wherein one end of the lead is secured to the first inner surface of the first circuit board, other end of the lead penetrates through the second circuit board, and the first circuit element and the second circuit element are electrically connected to each other through the lead.