Circuit device and method of manufacturing the same
View Patent ↗Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening.
1. A circuit device, comprising: a case member; a first circuit board fitted into a bottom portion of the case member;
a second circuit board fitted into the case member so as to define an internal space between the first and second circuit boards;
a first circuit element fixed to a principal surface of the first circuit board; and a second circuit element fixed to a principal surface of the second circuit board, wherein an opening is formed in the bottom portion of the case member and surrounds a side surface of the first circuit board, the opening comprising a plurality of openings, each of which is connected to the internal space of the case member so that the internal space and the opening in the bottom portion together form a conduit for air flow and the bottom portion of the case member further comprises a center opening, the first circuit board is fitted into the center opening of the case member, and the plurality of openings surrounds the center opening; and
a sealing resin covering at least the principal surface of the first circuit board and the first circuit element and covering at least the principal surface of the second circuit board and the second circuit element.
2. The circuit device according to claim 1 , wherein a side wall of the case member facing the opening has an inclined surface.
3. The circuit device according to claim 1 , wherein the internal space comprises a hollow portion which is not filled with the sealing resin.
4. The circuit device according to claim 1 , wherein a sidewall of the case member has an opening connected to the internal space of the case member.