Slider and suspension composite fiber solder joints

1. A slider and suspension assembly comprising:

a slider;

a suspension; and

a composite fiber solder formed in an S-shape coupled to the suspension and coupled to the slider, the composite fiber solder comprises a fiber and wherein said S-shape enables deformation of said composite fiber solder to absorb strain, wherein said composite fiber solder is in said S-shape prior to coupling with said slider.

2. The assembly of claim 1 , wherein the composite fiber solder comprises a solder ball.

3. The assembly of claim 1 , wherein the composite fiber solder comprises a wire.

4. The assembly of claim 1 , wherein the fiber is electrically conductive.

5. The assembly of claim 1 , wherein the fiber is electrically non-conductive.

6. The assembly of claim 1 , wherein the fiber is configured to reduce susceptibility to load/unload stresses compared to a solder without the fiber.

7. The assembly of claim 1 , wherein the fiber is configured to reduce susceptibility to seeking stresses compared to a solder without the fiber.

8. The assembly of claim 1 , wherein the fiber is configured to reduce susceptibility to crash stop stresses compared to a solder without the fiber.

9. The assembly of claim 1 , wherein the fiber is configured to reduce susceptibility to drop/shock stresses compared to a solder without the fiber.

10. The assembly of claim 1 , wherein the fiber is configured to reduce susceptibility to isothermal temperature stresses compared to a solder without the fiber.

11. A method of soldering joints comprising:

providing a suspension;

plotting a slider to the suspension;

providing a composite fiber solder formed in an S-shape; and

soldering the slider and the suspension using the composite fiber solder, wherein said S-shape enables deformation of said composite fiber solder to absorb strain in said pad during said soldering, wherein said composite fiber solder is in said S-shape prior to said soldering.

12. The method of claim 11 , further comprising applying an epoxy to the suspension; and after the plotting and prior to the soldering, curing the epoxy.

13. The method of claim 11 , further comprising preparing the composite fiber solder.

14. The method of claim 13 , wherein the preparation of the composite fiber solder further comprises mixing a fiber and melted solder.

15. The method of claim 13 , wherein the preparation of the composite fiber solder further comprises mixing a fiber and solid solder; and applying heat to the fiber and the solid solder above a melting temperature of the solid solder.

16. The method of claim 13 , wherein the preparation of the composite fiber solder further comprises forming the composite fiber solder into a wire.

17. The method of claim 13 , wherein the preparation of the composite fiber solder further comprises forming the composite fiber solder into a solder ball.

18. The method of claim 17 , further comprising providing a solder ball bonding machine, and wherein the soldering further comprises using the solder ball bonding machine to perform the soldering.

19. A hard disk drive comprising:

a hard disk;

a head configured to communicate with the hard disk; and

a slider and suspension assembly coupled to the head, the slider and suspension assembly comprising,

a slider,

a suspension, and

a composite fiber solder formed in an S-shape coupled to the suspension and coupled to the slider, the composite fiber solder comprises a fiber, wherein said S-shape enables deformation of said composite fiber solder to absorb strain, wherein said composite fiber solder is in said S-shape prior to coupling with said slider.

20. The hard disk drive of claim 19 , wherein the fiber is electrically conductive, and

wherein the fiber is configured to increase a fracture resistance of the composite fiber solder compared to a solder without the fiber.