Method of manufacturing a surface acoustic wave device
View Patent ↗A surface acoustic wave device is enable to prevent electrode erosion, without any specific environmental process. The surface acoustic wave device includes a piezoelectric substrate, an electrode for the formation of surface acoustic wave, being formed on the piezoelectric substrate, on the piezoelectric substrate, a frame-shaped layer surrounding the electrode for the formation of surface acoustic wave, and a lid body formed on the frame-shaped layer by bonding, so as to form a hollow portion between the lid body and the electrode for the formation of surface acoustic wave. The frame-shaped layer and the lid body include photosensitive resin, and the lid body includes a through hole, and the through hole is sealed with a halogen-free thermosetting resin.
1. A manufacturing method of a surface acoustic wave device comprising the steps of:
on a piezoelectric substrate, forming an electrode for a formation of the surface acoustic wave;
forming a frame-shaped layer surrounding the electrode for the formation of the surface acoustic wave being formed on the piezoelectric substrate;
on the frame-shaped layer, forming a lid body by bonding, having a through hole, so as to form a hollow between the lid body and the electrode for formation of the surface acoustic wave;
removing a halogen gas generated from the frame-shaped layer and the lid body via the through hole, by heating in a vacuum in a state of being bonded with the lid body; and
after removing the halogen gas, sealing the through hole with a halogen-free thermosetting resin.
2. The manufacturing method of the surface acoustic wave device according to claim 1 ,
wherein the step of removing the halogen gas via the through hole includes heating in the vacuum after retaining in an environment of high humidity and high temperature for a predetermined time.
3. The manufacturing method of the surface acoustic wave device according to claim 1 ,
wherein the step of removing the halogen gas via the through hole includes processing in H 2 O plasma.
4. The manufacturing method of the surface acoustic wave device according to claim 1 ,
wherein the step of forming the frame-shaped layer includes a step of spin coating a photosensitive negative resist.
5. The manufacturing method of the surface acoustic wave device according to claim 1 ,
wherein the step of forming the hollow by forming the lid body by bonding includes a step of forming a film-shaped photosensitive negative resist on the frame-shaped layer.
6. The manufacturing method of the surface acoustic wave device according to claim 1 ,
wherein the step of sealing the through hole includes a step of printing a paste-form halogen-free thermosetting resin inside the through hole.
7. The manufacturing method of the surface acoustic wave device according to claim 1 ,
wherein the step of sealing the through hole includes a step of forming a film-shaped halogen-free thermosetting resin on the lid body.