IP Library Granted Patent US 8,120,032
Granted Patent B2
US 8,120,032 · App. 12/242,932 · Granted Feb 21, 2012

Active device array substrate and fabrication method thereof

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Quick Facts
Patent No.
US 8,120,032
App. No.
12/242,932
Granted
Feb 21, 2012
Kind
B2
Abstract

A fabrication method of an active device array substrate is disclosed. A first metal material layer, a gate insulation material layer, a channel material layer, a second metal material layer, and a first photoresist layer are formed over a substrate sequentially. The first photoresist layer is patterned with a multi-tone mask to form a first patterned photoresist layer with two thicknesses. A first and second removing processes are performed sequentially using the first patterned photoresist layer as a mask to form a gate, a gate insulation layer, a channel layer, and a source/drain. The first patterned photoresist layer is removed. A passivation layer and a second patterned photoresist layer are formed over the substrate. A third removing process is performed to form a plurality of contact holes. A pixel electrode material layer is formed over the substrate. The second patterned photoresist layer is lifted off to form a pixel electrode.

Claims (14)

1. An active device array substrate, comprising:

a substrate;

a scan line, disposed over the substrate; and

an active device, disposed over the substrate, wherein the active device comprises:

a gate, disposed over the substrate and electrically connected to the scan line;

a gate insulation layer, disposed over the gate, wherein a width of the gate insulating layer is greater than a width of the gate such that an undercut concave is formed at a side of the gate with respect to the gate insulating layer;

a channel layer, disposed over the gate insulation layer;

a source/drain, respectively disposed over both sides of the channel layer; and

a passivation layer, covering the active device and the scan line, wherein the passivation layer comprises a plurality of contact holes, and a part of the contact holes exposes the source/drain;

a pixel electrode, disposed over the passivation layer and electrically connected to the drain through a part of the contact holes;

a plurality of first sub data line segments; and

a plurality of second sub data line segments, wherein the first sub data line segments and the source/drain are located on the same layer, the second sub data line segments and the pixel electrode are located on the same layer, the second sub data line segments are electrically connected between two of the first sub data line segments through a part of the contact holes to form a data line, and one of the second sub data line segments is electrically connected to the source through the corresponding contact hole.

2. The active device array substrate according to claim 1 further comprising a common line disposed over the substrate, wherein the common line and the gate are located on the same layer.

3. The active device array substrate according to claim 2 further comprising a storage capacitance electrode disposed above the common line, wherein the passivation layer is located between the storage capacitance electrode and the pixel electrode, and the pixel electrode is electrically connected to the storage capacitance electrode through the corresponding contact hole.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2016
From: HWZ INTANGIBLE ASSETS INVESTMENT MANAGEMENT LIMITED
To: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 040174/0599 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2016
From: CHUNGHWA PICTURE TUBES, LTD.
To: HWZ INTANGIBLE ASSETS INVESTMENT MANAGEMENT LIMITED
Reel/Frame 039332/0949 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2008
From: CHEN, SHIH-CHIN; WANG, WEN-CHUAN
To: CHUNGHWA PICTURE TUBES, LTD.
Reel/Frame 021639/0701 →