Organic light emitting device and manufacturing method thereof

1. An organic light emitting device comprising:

a substrate;

a first electrode formed on the substrate, the first electrode comprising a recess portion;

a partition formed on the first electrode, the partition comprising an opening exposing the recess portion of the first electrode;

an organic light emitting member formed in the recess portion of the first electrode and the opening of the partition; and

a second electrode formed on the partition and the organic light emitting member,

wherein a gap is formed between a lower portion of the partition and the recess portion of the first electrode and at least a portion of the organic light emitting member is disposed in the gap.

2. The organic light emitting device of claim 1 , wherein the organic light emitting member includes a hole transport layer and an emission layer, and the hole transport layer includes a portion disposed on the gap.

3. The organic light emitting device of claim 2 , wherein

the emission layer includes a portion disposed on the gap.

4. The organic light emitting device of claim 2 , wherein

the recess portion of the first electrode includes a bottom surface and a side surface formed according to a circumference of the bottom surface.

5. The organic light emitting device of claim 4 , wherein

the side surface of the recess portion is disposed in the gap.

6. The organic light emitting device of claim 5 , wherein

the side surface of the recess portion is vertically positioned to the bottom surface of the recess portion.

7. The organic light emitting device of claim 5 , wherein

the side surface of the recess portion is a curved surface, and a cross-section of the side surface is shaped in one of a half-circle, a quarter-circle, or a half-ellipse.

8. The organic light emitting device of claim 7 , wherein

an interval between a lower surface of the partition and the bottom surface of the recess portion is in a range of approximately 30 Å to approximately 2000 Å.

9. The organic light emitting device of claim 2 , wherein

a thickness of the hole transport layer is in a range of approximately 500 Å to approximately 2000 Å.

10. The organic light emitting device of claim 9 , wherein

an average surface roughness of the first electrode is in a range of approximately 0.5 nm to approximately 5.0 nm.

11. The organic light emitting device of claim 9 , further comprising:

an electron transport layer formed on the emission layer and disposed in the opening of the partition.

12. The organic light emitting device of claim 11 , wherein:

the second electrode is disposed on the electron transport layer; and

a first portion of the second electrode overlapping the electron transport layer is disposed in a same plane as a second portion of the second electrode overlapping the partition.

13. A manufacturing method for an organic light emitting device, comprising:

forming a first electrode on a substrate;

forming a partition having an opening, on the first electrode;

etching the first electrode by using the partition as a mask to form a recess portion;

forming a gap under the partition;

forming an organic light emitting member in the recess portion by filling at least a portion of the gap; and

forming a second electrode on the organic light emitting member.

14. The method of claim 13 , wherein

forming the partition comprises:

forming a photosensitive organic material layer or a photosensitive inorganic material layer on the first electrode; and

exposing and etching the photosensitive organic material layer or the photosensitive inorganic material layer to form an opening exposing the first electrode.

15. The method of claim 14 , further comprises:

forming the organic light emitting member by an Inkjet method.

16. The method of claim 15 , further comprises:

filling the organic light emitting member in the gap by a capillary phenomenon.

17. The method of claim 13 , wherein

forming the organic light emitting member comprises:

forming a hole injection layer on the first electrode; and

forming an emission layer on the hole injection layer.

18. The method of claim 17 , further comprises:

filling the hole injection layer in the gap.

19. The method of claim 17 , further comprises:

filling the hole injection layer and the emission layer in the gap.