Compressor assembly having electronics cooling system and method

1. A system comprising:

a compressor having a suction side for receiving low-pressure refrigerant and a discharge side for dispensing high-pressure refrigerant;

a pair of heat exchangers in communication with said compressor;

an expansion valve disposed between said heat exchangers;

a control module for controlling said expansion valve;

an electronics module externally mounted to the compressor;

a cooling apparatus mounted to the electronics module that receives said low-pressure refrigerant to cool said electronic module;

a temperature sensor located at an inlet of said cooling apparatus, said temperature sensor for detecting a temperature of said low-pressure refrigerant entering said cooling apparatus,

wherein said control module is in communication with said temperature sensor, and controls said expansion valve based on said temperature of said low-pressure refrigerant to minimize an amount of said low-pressure refrigerant in a liquid phase passing through said cooling apparatus.

2. The system of claim 1 , wherein said control module controls a liquid dry out point (LDOP) of said low-pressure refrigerant.

3. The system of claim 1 , wherein said control module controls superheating of said low-pressure refrigerant.

4. The system of claim 1 , wherein if said sensor detects a decrease in temperature of said low-pressure refrigerant, said control module causes said expansion valve to decrease an amount of refrigerant allowed to reach one of said heat exchangers.

5. The system of claim 1 , wherein if said sensor detects an increase in temperature of said refrigerant, said control module causes said expansion valve to increase an amount of refrigerant allowed to reach one of said heat exchangers.

6. A compressor for an air conditioning system or a heat pump system carrying a refrigerant, comprising:

a shell including a suction line for receiving low-pressure refrigerant and a discharge line for dispensing high-pressure refrigerant;

an electronics module externally mounted to said shell;

a cooling apparatus mounted to said electronics module that utilizes said low-pressure refrigerant to cool said electronics module;

a control module; and

a temperature sensor at an inlet of said cooling apparatus for detecting a temperature of said low-pressure refrigerant entering said cooling apparatus, said temperature sensor being in communication with said control module, and said control module minimizing an amount of said low-pressure refrigerant in a liquid phase passing through said cooling apparatus to cool said electronics module based on said temperature.

7. The compressor of claim 6 , wherein if said sensor detects a decrease in temperature of said low-pressure refrigerant, said control module decreases an amount of low-pressure refrigerant passing through said cooling apparatus.

8. The compressor of claim 6 , wherein if said sensor detects an increase in temperature of said low-pressure refrigerant, said control module increases an amount of low-pressure refrigerant passing through said cooling apparatus.

9. The compressor of claim 6 , wherein said control module controls a liquid dry out point (LDOP) of the refrigerant.

10. The compressor of claim 6 , wherein said control module controls superheating of said low-pressure refrigerant.

11. A method comprising cooling an electronics module that is externally mounted to a compressor using a cooling apparatus mounted to said electronics module with a low-pressure refrigerant that passes through said cooling apparatus, said step of cooling including monitoring a temperature of said low-pressure refrigerant with a temperature sensor located at an inlet of said cooling apparatus, said temperature sensor being in communication with a control module that minimizes a flow of said low-pressure refrigerant in a liquid phase entering said cooling apparatus based on said temperature.

12. The method of claim 11 , wherein controlling said flow controls a LDOP of said low-pressure refrigerant.

13. The method of claim 12 , wherein controlling said LDOP controls superheating of said low-pressure refrigerant.

14. The method of claim 11 , wherein if said sensor detects a decrease in temperature of said low-pressure refrigerant, said control module decreases said flow of low-pressure refrigerant.

15. The method of claim 11 , wherein if said sensor detects an increase in temperature of said low-pressure refrigerant, said control module increases said flow of low-pressure refrigerant.

16. A system comprising:

a compressor that discharges a high-pressure refrigerant;

a pair of heat exchangers in communication with said compressor;

an expansion valve disposed between said heat exchangers that converts said high-pressure refrigerant to a low-pressure refrigerant;

a control module for controlling said expansion valve;

an electronics module externally mounted to said compressor;

a cooling apparatus mounted to said electronics module for cooling said electronics module with said low-pressure refrigerant; and

a temperature sensor located directly adjacent an inlet of said cooling apparatus for detecting a temperature of said low-pressure refrigerant entering said cooling apparatus to cool said electronics module,

wherein if said sensor detects a decrease in temperature of said low-pressure refrigerant entering said cooling apparatus, said control module causes said expansion valve to decrease an amount of low-pressure refrigerant allowed to pass therethrough;

wherein if said sensor detects an increase in temperature of said low-pressure refrigerant entering said cooling apparatus, said control module causes said expansion valve to increase an amount of low-pressure refrigerant allowed to pass therethrough; and

said control module minimizes said low-pressure refrigerant in a liquid phase passing through said cooling apparatus.

17. The system of claim 16 , wherein increasing and decreasing said refrigerant with said expansion valve controls a LDOP of said refrigerant.

18. The system of claim 17 , wherein controlling said LDOP controls superheating of said low-pressure refrigerant.

19. The system of claim 16 , wherein said compressor is a variable speed compressor.

20. The system of claim 16 , wherein said electronics module includes an inverter.