IP Library Granted Patent US 8,202,011
Granted Patent B2
US 8,202,011 · App. 12/245,976 · Granted Jun 19, 2012

Printed circuit board assembly carrier for an optical electrical device

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Quick Facts
Patent No.
US 8,202,011
App. No.
12/245,976
Granted
Jun 19, 2012
Kind
B2
Abstract

A printed circuit board assembly (PCBA) carrier for enclosing an optical transceiver PCBA. The PCBA carrier includes a base portion including one or more first connection members, the base portion being configured to receive an optical transceiver PCBA and a top portion including one or more second connection members configured to couple to the first connection members to thereby secure the top portion to the base portion, the top portion being configured to reside above the optical transceiver PCBA when the first and second connection members are coupled. The PCBA carrier is further configured to enclose the optical transceiver PCBA when the base and top portions are coupled to provide a solid structure for the optical transceiver PCBA without the need for a separate optical transceiver module housing.

Claims (35)

1. A printed circuit board assembly (PCBA) carrier for enclosing an optical transceiver PCBA comprising:

a base portion including one or more first connection members, the base portion being configured to receive an optical transceiver PCBA; and

a top portion including one or more second connection members configured to couple to the first connection members to thereby secure the top portion to the base portion, the top portion being configured to reside above the optical transceiver PCBA when the first and second connection members are coupled;

wherein the PCBA carrier is configured to enclose the optical transceiver PCBA when the base and top portions are coupled to provide a solid structure for the optical transceiver PCBA without the need for a separate optical transceiver module housing, and

wherein the base portion and the top portion cooperate when coupled to define a pair of openings configured to allow a pair of optical sub-assemblies of the optical transceiver PCBA to extend outside the carrier, the pair of openings being configured such that at least a portion of a flange region of each of the pair of optical sub-assemblies is positioned in the corresponding opening when the pair of optical sub-assemblies of the optical transceiver PCBA extend outside the carrier.

2. The PCBA carrier in accordance with claim 1 , wherein the first and second connection members extend from the base and top portions.

3. The PCBA carrier in accordance with claim 2 , wherein the first connection members include knobs and the second connection members include holes, wherein the knobs are configured to be received by the holes when coupling the base portion and the top portion.

4. The PCBA carrier in accordance with claim 1 , further comprising an end portion coupled between the base and top portions, the end portion being configured to surround a portion of the optical transceiver PCBA.

5. The PCBA carrier in accordance with claim 4 , wherein the end portion is coupled to the base portion by a first hinge member and is coupled to the top portion by a second hinge member such that the end portion may rotate in relation to the base portion and the top portion may rotate in relation to the end portion.

6. The PCBA carrier in accordance with claim 4 , wherein the end portion defines an opening for an electrical interface of the optical transceiver PCBA when the PCBA carrier encloses the optical transceiver PCBA.

7. The PCBA carrier in accordance with claim 1 , wherein the base portion includes one or more posts that extend from the main body of the base portion and are configured to align the optical transceiver PCBA when the optical transceiver PCBA is enclosed by the PCBA carrier.

8. The PCBA carrier in accordance with claim 1 , wherein the top portion includes one or more extending posts that are configured to extend towards the base portion when the base and top portions are coupled, wherein the one or more extending posts are further configured to bias the optical transceiver PCBA downward when the PCBA carrier encloses the optical transceiver PCBA such that the optical transceiver PCBA is held in position without the need for additional fasteners.

9. The PCBA carrier in accordance with claim 1 , wherein the PCBA carrier is configured to allow testing of the optical transceiver PCBA without the use of the separate optical transceiver module housing.

10. The PCBA carrier in accordance with claim 1 , wherein the PCBA carrier is comprised of plastic.

11. The PCBA carrier in accordance with claim 1 , wherein the top portion defines an opening configured to receive a snap-in heat sink or snap-in EMI absorption material.

12. A printed circuit board assembly (PCBA) carrier for enclosing an optical transceiver PCBA comprising:

a base portion including one or more first connection members, the base portion being configured to receive an optical transceiver PCBA;

a top portion including one or more second connection members configured to couple to the first connection members to thereby secure the top portion to the base portion, the top portion being configured to reside above the optical transceiver PCBA when the first and second connection members are coupled; and

an end portion coupled to the base portion by a first hinge portion and coupled to the top portion by a second hinge portion such that the end portion may rotate in relation to the base portion and the top portion may rotate in relation to the end portion, the end portion being configured to receive a portion of the optical transceiver PCBA;

wherein the PCBA carrier is configured to enclose the optical transceiver PCBA when the base and top portions are coupled to provide a solid structure for the optical transceiver PCBA without the need for a separate optical transceiver module housing.

13. The PCBA carrier in accordance with claim 12 , wherein the first and second connection members extend from the base and top portions respectively and define one or more openings for an optical sub-assembly of the optical transceiver PCBA when coupled.

14. The PCBA carrier in accordance with claim 12 ,

wherein the base portion includes one or more posts that extend from the main body of the base portion and are configured to align the optical transceiver PCBA when the optical transceiver PCBA is enclosed by the PCBA carrier.

15. The PCBA carrier in accordance with claim 12 , wherein the top portion includes one or more extending posts that are configured to extend towards the base portion when the base and top portions are coupled, wherein the one or more extending posts are further configured to bias the optical transceiver PCBA downward when the PCBA carrier encloses the optical transceiver PCBA such that the optical transceiver PCBA is held in position without the need for additional fasteners.

16. The PCBA carrier in accordance with claim 12 , wherein the end portion defines an opening for an electrical interface of the optical transceiver PCBA when the PCBA carrier encloses the optical transceiver PCBA.

17. An optoelectronic transceiver module comprising:

a module shell defining a cavity; and

a printed circuit board assembly (PCBA) carrier configured to be placed in the cavity of the module shell, the PCBA carrier comprising:

a base portion including one or more first connection members, the base portion being configured to receive an optical transceiver PCBA;

a top portion including one or more second connection members configured to couple to the second connection members to thereby secure the top portion to the base portion, the top portion being configured to reside above the optical transceiver PCBA when the first and second connection members are coupled; and

an end portion coupled to the base portion by a first hinge portion and coupled to the top portion by a second hinge portion such that the end portion may rotate in relation to the base portion and the top portion may rotate in relation to the end portion, the end portion being configured to receive a portion of the optical transceiver PCBA;

wherein the PCBA carrier is configured to enclose the optical transceiver PCBA when the base and top portions are coupled to provide a solid structure for the optical transceiver PCBA without the need for a separate optical transceiver module housing.

18. The optoelectronic transceiver module of claim 17 , wherein the end portion includes a clip configured to couple with an opening of the module housing to thereby at least partially secure the PCBA carrier in the cavity of the of the module housing and wherein the end portion acts as an end plug of the module housing, the end portion defining an opening for an electrical interface of the optical transceiver PCBA when the PCBA carrier encloses the optical transceiver PCBA.

19. The optoelectronic transceiver module in accordance with claim 17 , wherein the module shell does not include any parts, components, or elements for aligning the PCBA carrier.

20. The optoelectronic transceiver module in accordance with claim 17 , wherein the module shell includes one or more parts, components, or elements for aligning the PCBA carrier.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2008
From: MOORE, JOSHUA
To: FINISAR CORPORATION
Reel/Frame 021661/0850 →