IP Library Patent Application 12246004
Patent Application
App. No. 12/246,004

Nanostructure Films

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Patent No.
US None
App. No.
12/246,004
Abstract

A nanostructure film, comprising at least one interconnected network of nanostructures, wherein the nanostructure film is optically transparent and electrically conductive. A method for improving the optoelectronic properties of a nanostructure film, comprising: forming a nanostructure film having a thickness that, if uniform, would result in a first optical transparency and a first sheet resistance that are lower than desired; and patterning holes in the nanostructure film, such that a desired higher second optical transparency and a second sheet resistance are achieved. A method for depositing a nanostructure film on a rigid substrate comprises: depositing the nanostructure film on a flexible substrate; and transferring the nanostructure film from the flexible substrate to a rigid substrate, wherein the flexible substrate comprises at least one of a release liner and a heat- or chemical-sensitive adhesive layer.

Claims (12)

1 . A nanostructure film, comprising at least one interconnected network of nanostructures, wherein the nanostructure film is optically transparent and electrically conductive.

2 . The nanostructure film of claim 1 , further comprising a pattern within the nanostructure film.

3 . The nanostructure film of claim 2 , wherein the pattern is a pattern of microscale holes.

4 . The nanostructure film of claim 3 , wherein the pattern is a regular pattern of microscale holes.

5 . The nanostructure film of claim 3 , further comprising at least one of a hydrophobic polymer, a block copolymer and a lift-off layer between the nanostructure film and an underlying substrate.

6 . A method for improving the optoelectronic properties of a nanostructure film, comprising:

forming a nanostructure film having a thickness that, if uniform, would result in a first optical transparency and a first sheet resistance that are lower than desired; and

patterning holes in the nanostructure film, such that a desired higher second optical transparency and a second sheet resistance are achieved.

7 . The method of claim 6 , wherein the holes are patterned by depositing at least one of a hydrophobic polymer, a block copolymer and a lift-off layer between the nanostructure film and an underlying substrate.

8 . A method for depositing a nanostructure film on a rigid substrate, comprising:

depositing the nanostructure film on a flexible substrate; and

transferring the nanostructure film from the flexible substrate to a rigid substrate, wherein the flexible substrate comprises at least one of a release liner and a heat- or chemical-sensitive adhesive layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2011
From: UNIDYM, INC.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025875/0331 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2008
From: DRZAIC, PAUL; HECHT, DAVID; O'CONNELL, MICHAEL; IRVIN, GLEN
To: UNIDYM, INC.
Reel/Frame 021863/0788 →